HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE
申请人:SUMITOMO BAKELITE CO., LTD.
公开号:EP1327653A1
公开(公告)日:2003-07-16
A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.
一种在分子中含有交联基团并具有特定结构的聚苯并恶唑树脂前体,一种由该前体通过缩合反应和交联反应得到的聚苯并恶唑树脂,一种由该聚苯并恶唑树脂组成的绝缘膜,以及一种由多层布线中的绝缘夹层膜或由上述绝缘膜组成的表面保护膜组成的半导体器件。前体在溶剂中具有极佳的溶解性,因此具有极佳的加工性,并且在闭环后具有极佳的热稳定性。该树脂具有优异的电气、物理和机械性能,可用于半导体设备的绝缘夹层薄膜和类似用途。