Pattern forming method, composition kit and resist film, manufacturing method of electronic device using these, and electronic device
申请人:FUJIFILM Corporation
公开号:US10031419B2
公开(公告)日:2018-07-24
There is provided a pattern forming method comprising (i) forming a film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a resin which decomposes due to an action of an acid to change its solubility with respect to a developer and (C) a specific resin, (ii) forming a top coat layer using a top coat composition which contains a resin (T) on the film, (iii) exposing the film which has the top coat layer to actinic rays or radiation, and (iv) forming a pattern by developing the film which has the top coat layer after the exposing.
本发明提供了一种图案形成方法,包括(i)使用感光树脂组合物或辐射敏感树脂组合物在基底上形成胶片,该组合物包含(A)由于酸的作用而分解,从而改变其相对于显影剂的溶解度的树脂和(C)特定树脂、(ii) 使用含有树脂 (T) 的表层组合物在胶片上形成表层,(iii) 将具有表层的胶片暴露于放 射线或辐射,(iv) 在暴露后对具有表层的胶片进行显影,形成图案。