申请人:Namics Corporation
公开号:EP3705501A1
公开(公告)日:2020-09-09
An object of the present invention is to provide a resin composition that is curable at low temperatures around room temperature in a relatively short time (within several hours), and is not prone to produce contamination on the surroundings caused by resin volatilization, and that is suitable as a one-part adhesive for use in the manufacture of an image sensor module or an electronic component.
The resin composition of the present invention contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater. Further, the 2-methylene-1,3-dicarbonyl compound is a compound containing a structural unit represented by formula (I) below.
本发明的目的是提供一种树脂组合物,该树脂组合物可在室温附近的低温下于较短时间内(数小时内)固化,且不易因树脂挥发而对周围环境造成污染,并适合用作制造图像传感器模块或电子元件的单组分粘合剂。
本发明的树脂组合物含有 2-亚甲基-1,3-二羰基化合物和引发剂。2-亚甲基-1,3-二羰基化合物的分子量为 180 至 10,000,引发剂含有 pKa 为 8 或更大的碱性物质。此外,2-亚甲基-1,3-二羰基化合物是含有下式(I)所代表结构单元的化合物。