对-亚联苯基-双苯偏三酸酯二酐 | 10340-81-5

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 中文名称: 对-亚联苯基-双苯偏三酸酯二酐
• 英文名称: [1,1'-biphenyl]-4,4'-diyl bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate)
• 英文别名: 4,4'-bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-ylcarbonyloxy)biphenyl；[4-[4-(1,3-Dioxo-2-benzofuran-5-carbonyl)oxyphenyl]phenyl] 1,3-dioxo-2-benzofuran-5-carboxylate
• CAS: 10340-81-5
• 化学式: C₃₀H₁₄O₁₀
• 分子量: 534.435
• InChiKey: HNNDKAIIAPKDGO-UHFFFAOYSA-N

物化性质

• 熔点：
  303-305 °C
• 沸点：
  814.9±65.0 °C(Predicted)
• 密度：
  1.536±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  40
• 可旋转键数：
  7
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  139
• 氢给体数：
  0
• 氢受体数：
  10

反应信息

• 作为产物：
  描述：

  4,4'-二羟基联苯 、 氯化偏苯三酸酐 在 吡啶 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 45.0h， 以80%的产率得到对-亚联苯基-双苯偏三酸酯二酐
  参考文献：
  名称：

  TW2019/36593

  摘要：

  公开号：

文献信息

• DIAMINE COMPOUND, AND POLYIMIDE COMPOUND AND MOLDED ARTICLE IN WHICH SAID DIAMINE COMPOUND IS USED
  申请人：Wingo Technology Co., Ltd.

  公开号：EP3575281A1

  公开（公告）日：2019-12-04

  [Problems to be solved] The present invention provides a novel diamine compound which allows for the synthesis of a polyimide compound having a high solubility in an organic solvent and a high melt moldability. [Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1): (wherein R1 to R8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R1 to R8 is a substituted or unsubstituted aromatic group).

  [有待解决的问题] 本发明提供了一种新型二胺化合物，它可以合成在有机溶剂中具有高溶解度和高熔融模 塑性的聚酰亚胺化合物。 [解决方案] 根据本发明的二胺化合物的特征是由以下通式（1）表示： 其中 R1至R8各自独立地选自由氢原子、氟原子、取代或未取代的烷基、取代或未取代的芳基组成的组；且R1至R8中至少有一个是取代或未取代的芳基）。
• Diamine compound, and polyimide compound and molded product using the same
  申请人：WINGO TECHNOLOGY CO., LTD.

  公开号：US10683259B2

  公开（公告）日：2020-06-16

  [Problems to be solved] The present invention provides a novel diamine compound which allows for the synthesis of a polyimide compound having a high solubility in an organic solvent and a high melt moldability. [Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1): (wherein R1 to R8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R1 to R8 is a substituted or unsubstituted aromatic group).

  [有待解决的问题] 本发明提供了一种新型二胺化合物，它可以合成在有机溶剂中具有高溶解度和高熔融模 塑性的聚酰亚胺化合物。 [解决方案] 根据本发明的二胺化合物的特征是由以下通式（1）表示： 其中 R1 至 R8 各自独立地选自由氢原子、氟原子、取代或未取代的烷基和取代或未取代的芳基组成的组；且 R1 至 R8 中至少有一个是取代或未取代的芳基）。
• METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER
  申请人：Honshu Chemical Industry Co., Ltd.

  公开号：EP2383265B1

  公开（公告）日：2015-03-11
• ESTER GROUP-CONTAINING TETRACARBOXYLIC ACID DIANHYDRIDE, POLYESTER POLYIMIDE PRECURSOR, POLYESTERIMIDE, AND METHODS FOR PRODUCING SAME
  申请人：Hasegawa Masatoshi

  公开号：US20120029164A1

  公开（公告）日：2012-02-02

  Disclosed is a polyesterimide having a repeating unit expressed by the formula below, and also provides the manufacturing methods thereof: wherein R represents a phenyl group, R 1 represents an alkyl group with 1 to 6 carbon atoms or alkoxy group with 1 to 6 carbon atoms, n each independently takes a value of 0 to 4, a each independently takes a value of 0 to 4, and m represents an integer of 2 to 4, where not all n's are 0 at the same time and 0≦n+a≦4 is satisfied by each phenylene group, and X is a divalent aromatic group and/or aliphatic group.
• PHOTOSENSITIVE RESIN COMPOSITION
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20200209745A1

  公开（公告）日：2020-07-02

  A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.