申请人:JAPAN SYNTHETIC RUBBER CO., LTD.
公开号:EP0844283A1
公开(公告)日:1998-05-27
A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.
一种可固化树脂组合物,包括(A)有机硅烷化合物的水解物或部分缩合物,或二者;(B)至少一种化合物,选自由具有可水解硅基或羧酸酐基或二者皆有的聚酰胺和具有可水解硅基或羧酸酐基或二者皆有的聚酰亚胺组成的组;(C) 与选自锆、钛和铝组成的金属的螯合物或烷氧基化合物,或螯合物和烷氧基化合物。这种树脂组合物可以在不产生裂缝的情况下固化和制造成固化产品,例如具有低介电常数、高耐热性和防潮性、与各种基底材料的良好粘合性、优异的电绝缘性能和低吸湿性的半导体器件。使用这种可固化树脂组合物作为绝缘膜的半导体器件耗电量低、工作速度快、可靠性高。