An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.
本发明的目的是提供一种环氧改性聚
酰亚胺,它是一种能在低加工温度下处理的
树脂,具有优异的耐热性;感光组合物;覆盖膜,它具有优异的电绝缘性能、焊接耐热性、成膜性、柔韧性和耐
化学性;阻焊剂;以及印刷线路板。环氧改性聚
酰亚胺是通过合成具有羟基或羧基的聚
酰亚胺,然后使聚
酰亚胺与环氧化合物反应而得到的。光敏组合物是通过向环氧改性聚
酰亚胺中添加光反应
引发剂或类似物而获得的。覆盖膜和阻焊可以由光敏组合物形成。使用覆盖膜和阻焊层生产出印刷线路板。