Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1:
wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.
本发明公开了一种用于生产光电子器件柔性电路板的聚
酰亚胺前体组合物。该聚
酰亚胺前体组合物包括一种聚
酰亚胺前体,由包括式 1 结构的二胺或酸二酐衍生而来:
其中 R1 至 R8、m1、m2 和 m3 如说明书中所定义。还公开了一种由聚
酰亚胺前体组合物制成的聚
酰亚胺薄膜。该聚
酰亚胺薄膜是通过将前体组合物涂在基底上并固化组合物而得到的。聚
酰亚胺薄膜具有高透明度和良好的耐热性。此外,聚
酰亚胺薄膜还具有良好的尺寸稳定性,因为即使在高温热处理期间,基底也不会出现应力增加的情况。