2,2-bis-[4-(1,3-dioxo-1,3-dihydro-isobenzofuran-5-carbonyloxy)-phenyl]-propane | 2770-50-5

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 2,2-bis-[4-(1,3-dioxo-1,3-dihydro-isobenzofuran-5-carbonyloxy)-phenyl]-propane
• 英文别名: 1,3-dihydro-1,3-dioxo-5-isobenzofuran-carboxylic acid, 1-(methylethylidene)-di-4,1-phenylene ester；2,2-bis{4-(1,3-dioxo-1,3-dihydroisobenzofuran-5-ylcarbonyloxy)phenyl}propane；ESDA；[4-[2-[4-(1,3-Dioxo-2-benzofuran-5-carbonyl)oxyphenyl]propan-2-yl]phenyl] 1,3-dioxo-2-benzofuran-5-carboxylate
• CAS: 2770-50-5
• 化学式: C₃₃H₂₀O₁₀
• 分子量: 576.516
• InChiKey: GRFCXTHLKTWDBI-UHFFFAOYSA-N

物化性质

• 熔点：
  100 °C
• 沸点：
  806.4±65.0 °C(Predicted)
• 密度：
  1.456±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6.3
• 重原子数：
  43
• 可旋转键数：
  8
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.09
• 拓扑面积：
  139
• 氢给体数：
  0
• 氢受体数：
  10

反应信息

• 作为产物：
  描述：

  双酚A 在 lithium acetate 作用下， 以 二苯醚 为溶剂， 反应 9.5h， 生成 2,2-bis-[4-(1,3-dioxo-1,3-dihydro-isobenzofuran-5-carbonyloxy)-phenyl]-propane
  参考文献：
  名称：

  METHOD FOR MANUFACTURING TRIMELLITIC ANHYDRIDE ARYL ESTER

  摘要：

  公开号：

  EP2383265B1

文献信息

• Hamciuc, Corneliu; Hamciuc, Elena; Sava, Ion, Revue Roumaine de Chimie, 2001, vol. 46, # 9, p. 1019 - 1027
  作者：Hamciuc, Corneliu、Hamciuc, Elena、Sava, Ion、Brumǎ, Maria、Szesztay, Marta

  DOI：——

  日期：——
• RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND METHOD FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND METHOD FOR MAKING THE SAME
  申请人：YOSHIDA Kenta

  公开号：US20110076613A1

  公开（公告）日：2011-03-31

  A resin composition for laser engraving, including at least a phenol derivative (A) represented by the following Formula (A), a binder polymer (B), and a crosslinking agent (C), wherein the content of the phenol derivative (A) with respect to the total solid content of the resin composition is from 5% by mass to 50% by mass:
• PHOTOSENSITIVE RESIN COMPOSITION
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20200209745A1

  公开（公告）日：2020-07-02

  A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.
• RESIN COMPOSITION FOR INSULATING FILM
  申请人：NISSAN CHEMICAL CORPORATION

  公开号：US20200347226A1

  公开（公告）日：2020-11-05

  A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.
• US7247367B2
  申请人：——

  公开号：US7247367B2

  公开（公告）日：2007-07-24