2,2',3,3',5,5',6,6'-octachloro-4,4'-biphenol | 21647-18-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2',3,3',5,5',6,6'-octachloro-4,4'-biphenol
• 英文别名: 4,4'-dihydroxy-2,2',3,3',5,5',6,6'-octachlorobiphenyl；ortochlorodihydroxybiphenyl；4,4'-dihydroxyoctachlorobiphenyl；2,3,5,6,2',3',5',6'-octachloro-biphenyl-4,4'-diol；2,3,5,6,2',3',5',6'-Octachlor-biphenyl-4,4'-diol；2.3.5.6.2'.3'.5'.6'-Octachlor-4.4'-dihydroxy-biphenyl；2,2',3,3',5,5',6,6'-Octachloro[1,1'-biphenyl]-4,4'-diol；2,3,5,6-tetrachloro-4-(2,3,5,6-tetrachloro-4-hydroxyphenyl)phenol
• CAS: 21647-18-7
• 化学式: C₁₂H₂Cl₈O₂
• 分子量: 461.771
• InChiKey: FJJYYMJJQCQPAT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.3
• 重原子数：
  22
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  2,2',3,3',5,5',6,6'-octachloro-4,4'-biphenol 在 氯 、 溶剂黄146 作用下， 生成 decachloro-[2,2']bicyclohexa-1,3-dienyl-5,5'-dione
  参考文献：
  名称：

  Hindered Diphenoquinones: Diradicals of Oxygen¹

  摘要：

  DOI：

  10.1021/jo01353a001
• 作为产物：
  描述：

  十氯联苯 在 氢氧化钾 作用下， 生成 2,2',3,3',5,5',6,6'-octachloro-4,4'-biphenol
  参考文献：
  名称：

  Octa-chloro-biphenyl quinone

  摘要：

  公开号：

  US02449088A1

文献信息

• Process for the preparation of halogenated (meth)acrylic esters and poly (meth) arcylates obtained with said (meth)acrylic esters
  申请人：Akzo Nobel N.V.

  公开号：EP0824096A2

  公开（公告）日：1998-02-18

  The present invention is directed to a process for the preparation of (meth)acrylates of halogenated alcohols by direct esterification of said alcohols with (meth)acrylic acid (chloride) wherein at least 2,6-substituted pyridine derivative is used as a polymerization inhibitor at room temperature or lower. Suitable at least 2,6-substituted pyridine derivatives are 2,6-lutidine, 2,4,6-collidine or 2,6-di-tert.butyl-4-methyl pyridine. With the halogenated (meth)acrylate esters prepared with the process according to the invention, very pure homo- and copolymers can be prepared, resulting in polymers having a low optical loss of 0.1 dB/cm or lower at 1300 nm and lower than 0.4 dB/cm at 1550 nm.

  本发明涉及一种通过将卤代醇与（甲基）丙烯酸（氯化物）直接酯化来制备（甲基）丙烯酸酯的方法，其中至少使用一种2,6-取代吡啶衍生物作为聚合抑制剂，温度为室温或更低。适用的至少2,6-取代吡啶衍生物包括2,6-吡啶、2,4,6-考林或2,6-二叔丁基-4-甲基吡啶。 通过根据本发明的方法制备的卤代（甲基）丙烯酸酯，可以制备非常纯净的同聚物和共聚物，从而得到在1300纳米处光学损耗低至0.1 dB/cm或更低，在1550纳米处低于0.4 dB/cm的聚合物。
• ALDOSE REDUCTASE INHIBITORS AND PHARMACEUTICAL COMPOSITIONS
  申请人：——

  公开号：US20030153628A1

  公开（公告）日：2003-08-14

  1 Medicaments for treating diabetic complications contain a compound of formula (A), wherein at least one Y or one Y′ is OH, and the remainder are selected from H, Hal, OH, OMe and NO 2 ; X is O, S, keto or a direct link.

  用于治疗糖尿病并发症的药物包含一个化合物（A）的配方，其中至少有一个Y或一个Y′是OH，其余选择自H，Hal，OH，OMe和NO2; X为O，S，keto或直接连接。
• Curable epoxy resin composition
  申请人：ASAHI DENKA KOGYO KABUSHIKI KAISHA

  公开号：EP0197458A2

  公开（公告）日：1986-10-15

  A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic , resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.

  本发明提供了一种单组分热固性环氧树脂组合物，其不可或缺的成分包括：(I) 分子中平均含有一个以上相邻环氧基团的环氧树脂；(II) 固化量或固化加速量的化合物，该化合物由(a)特定的胺/环氧加合物与(b)酚醛树脂和/或多羟基酚化合物反应而得，(a)与(b)的重量比为 1/0.1 至 1/0.8。本发明的组合物具有极佳的储存稳定性，可在相对较低的温度下固化，形成具有极佳机械强度、粘合性和耐水性的固化产品。
• Curable epoxy resin compositions
  申请人：ASAHI DENKA KOGYO KABUSHIKI KAISHA

  公开号：EP0758661A2

  公开（公告）日：1997-02-19

  A curable epoxy resin composition comprising (I) an epoxy resin having on average more than one epoxy group per molecule, (II) a specific Mannich base and, optionally, (IV) a specific amino compound, with the amount of the Mannich base (II) being 1 to 50 parts by weight per 100 parts by weight of the resin (I) and the amount of any amino compound (IV) being 5 to 200 parts by weight per 100 parts of the resin (I), is low in odor and therefore easy to handle, can be excellent in low-temperature curing characteristics, and its cured product can exhibit excellent resistances to water, chemicals and amine blushing, and have excellent physical properties. The resin can be constituted as a two-liquid type having the resin (I) separate from the base (II) and any amino compound (IV), or as a three-liquid type in which (I), (II) and (IV) are separate from one another. The curing agent comprising the Mannich base (II), both with and without the amino compound (IV), is also disclosed.

  一种可固化的环氧树脂组合物，包括(I)平均每个分子具有一个以上环氧基团的环氧树脂，(II)特定的曼尼希碱，以及可选的(IV)特定的氨基化合物，其中曼尼希碱(II)的用量为每 100 重量份树脂(I)1 至 50 重量份，任何氨基化合物(IV)的用量为每 100 重量份树脂(I)5 至 200 重量份、低气味，因此易于处理，具有优异的低温固化特性，其固化物具有优异的耐水性、耐化学性和耐碱性，并具有优异的物理性能。该树脂可以是树脂（I）与基质（II）和任何氨基化合物（IV）分离的二液型，也可以是（I）、（II）和（IV）相互分离的三液型。此外，还公开了由曼尼希碱（II）（含或不含氨基化合物（IV））组成的固化剂。
• CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR
  申请人：SANYO CHEMICAL INDUSTRIES, LTD.

  公开号：EP1375553A1

  公开（公告）日：2004-01-02

  The present invention uses a curable resin which has: in the molecule thereof, at least two crosslinking functional groups of at least one kind selected from the group consisting of epoxy group, (meth)acryloyl group, alkenylamino group and alkenyloxy group; a glass transition temperature before curing of 50 to 150°C; a weight-average molecular weight of 10,000 to 1,000,000; and a dielectric constant of not higher than 3.5 after curing. By use of the curable resin of the above constitution, the present invention can provide a curable resin that an insulator having an excellent thermal shock resistance and an excellent dielectric property is obtained.

  本发明使用的可固化树脂具有：在其分子中，至少有两个交联官能团，这两个官能团至少选 自由环氧基、（甲基）丙烯酰基、烯酰氨基和烯酰氧基组成的组中的一种；固化前的玻璃化温度为 50 至 150°C；重量平均分子量为 10,000 至 1,000,000 ；以及固化后的介电常数不高于 3.5。通过使用上述构成的可固化树脂，本发明可以提供一种可固化树脂，从而获得具有优异抗热震性和优异介电性能的绝缘体。