Palladium-Catalyzed Direct Decarbonylative Phosphorylation of Benzoic Acids with P(O)-H Compounds
作者:Ji-Shu Zhang、Tieqiao Chen、Li-Biao Han
DOI:10.1002/ejoc.201901865
日期:2020.3.8
A direct decarbonylative phosphorylation of benzoic acidscatalyzed by palladium was disclosed. Under the reaction conditions, a wide range of carboxylic acids coupled readily with all the three kinds of P(O)–H compounds, i.e. secondary phosphine oxides, H‐phosphinates and H‐phosphonates, producing the corresponding organophosphorus compounds in good to high yields. This reaction could be conducted
Iridium(III)-Catalyzed C−H Functionalization of Triarylphosphine Oxides with Diazo Dicarbonyl Compounds: Synthesis of α-Aryl 1,3-Dicarbonyl Derivatives
作者:Shang-Dong Yang、Qin-Xin Lou、Jing-Yu Li
DOI:10.1055/a-1409-1906
日期:2021.8
A novel (pentamethylcyclopenta-1,3-dienyl)iridium(III)-catalyzed direct C–H functionalization of triarylphosphine oxides with diazo dicarbonyl compounds through carbene insertion has been developed. This strategy provides a simple and efficientroute to the construction of α-arylated 1,3-dicarbonyl compounds, which are important building blocks in pharmaceutical chemistry.
[EN] HIGH HEAT MONOMERS AND METHODS OF USE THEREOF<br/>[FR] MONOMÈRES À CHALEUR ÉLEVÉE ET LEURS PROCÉDÉS D'UTILISATION
申请人:SABIC GLOBAL TECHNOLOGIES BV
公开号:WO2016014536A1
公开(公告)日:2016-01-28
High purity epoxide compounds, methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.
Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
申请人:——
公开号:US20040225080A1
公开(公告)日:2004-11-11
There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.