申请人:LeaRonal, Inc.
公开号:EP0107109A2
公开(公告)日:1984-05-02
Acid copper electroplating solutions containing the reaction product of
(1) a compound of the formula
wherein R1 and R2 are lower alkyl radicals of with 1 to 6 carbon atoms, a hydrogen atom or mixtures thereof and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX, wherein X is an alkali metal, hydrogen or magnesium, or a compound of the formula
wherein R3 is an aromatic, heterocyclic or alicyclic radical containing 3 to 12 carbon atoms and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX where X is an alkali metal, hydrogen or magnesium,
(2) a compound of the formula
wherein R, and R2 are the same or different and are alkylene radicals containing 1 to 6 carbon atoms, X is hydrogen or -SO,H and n equals 2 to 5, and
(3) acrylamide in a sufficient amount to increase the brightness of the deposit and/or to prevent the formation of cracks during thermal shock.
酸性电镀铜溶液中含有以下物质的反应产物
(1) 式中化合物
其中 R1 和 R2 是含 1 至 6 个碳原子的低级烷基、氢原子或它们的混合物,R4 是碱金属、氢、镁或基团 SX 或 SSX,其中 X 是碱金属、氢或镁,或式化合物
其中 R3 是含 3 至 12 个碳原子的芳香基、杂环基或脂环基,R4 是碱金属、氢、镁或基团 SX 或 SSX,其中 X 是碱金属、氢或镁、
(2) 式中化合物
其中 R 和 R2 相同或不同,且为含 1 至 6 个碳原子的亚烷基,X 为氢或-SO,H,n 等于 2 至 5,以及
(3) 足够量的丙烯酰胺,以增加沉积物的亮度和/或防止热冲击时裂纹的形成。