3,3'-二溴-5,5',7,7'-四甲基-1,1'-联金刚烷 | 63263-14-9

• 分子结构分类: 有机化合物 - 有机卤素化合物 - 有机溴化物
• 中文名称: 3,3'-二溴-5,5',7,7'-四甲基-1,1'-联金刚烷
• 英文名称: 3,3'-dibromo-5,5',7,7'-tetramethyl-1,1'-biadamantane
• 英文别名: 1-bromo-3-(3-bromo-5,7-dimethyl-1-adamantyl)-5,7-dimethyladamantane
• CAS: 63263-14-9
• 化学式: C₂₄H₃₆Br₂
• 分子量: 484.358
• InChiKey: LWCZHLNLGSQKMF-UHFFFAOYSA-N

物化性质

• 密度：
  1.516

计算性质

• 辛醇/水分配系数(LogP)：
  8.4
• 重原子数：
  26
• 可旋转键数：
  1
• 环数：
  8.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为反应物：
  描述：

  3,3'-二溴-5,5',7,7'-四甲基-1,1'-联金刚烷 、 苯 在 三氯化铁 氮 、 丙酮 作用下， 以 水 为溶剂， 反应 5.0h， 以gave 14.2 g (in a yield of 97%) of 3,3′-di(phenyl)-5,5′,7,7′-tetramethyl-1,1′-biadamantane的产率得到3,3'-di(phenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane
  参考文献：
  名称：

  Ethynylphenylbiadamantane derivatives

  摘要：

  本发明涉及一种半苯基双金刚烷衍生物，其化学式如下（1）：其中，R1，R2，R3，R4，R5和R6各自独立地表示氢原子或具有大约六个或更少碳原子的卤素取代或未取代的烷基或环烷基，但至少其中一个R1到R6表示以下化学式（2）所代表的取代基：其中，X表示卤素原子；“n”表示1到5的自然数，当R1到R6中仅有一个是化学式（2）的取代基时，那么R1到R6中至少有一个是具有大约六个或更少碳原子的卤素取代或未取代的烷基或环烷基，或者“n”是2或更多的自然数。该半苯基双金刚烷衍生物可用作各种双金刚烷衍生物的中间体材料。

  公开号：

  US20090030248A1
• 作为产物：
  描述：

  1-溴-3,5-二甲基金刚烷 在 silver(I) bromide 、 溴 、 magnesium 作用下， 以 乙醚 为溶剂， 生成 3,3'-二溴-5,5',7,7'-四甲基-1,1'-联金刚烷
  参考文献：
  名称：

  取代金刚烷的阳极氧化

  摘要：

  报告了一系列1-烷基金刚烷的光电子能谱和伏安数据。在三氟乙酸或乙腈中对scsc进行阳极氧化，得到电荷离域的阳离子自由基。而金刚烷，1-乙基金刚烷。1-甲基金刚烷和1-异丙基金刚烷通过质子损失而从阳离子基团产生产物，其他更高度取代的衍生物为例如。1-叔丁基金刚烷。通过碳-碳键的断裂优先提供产品。去质子化和碎片化之间的竞争由离开的碳正离子的稳定性控制。仅在第三级群体离开时才是碎片占主导地位。

  DOI：

  10.1039/p29770000505

文献信息

• Film forming composition, insulating film formed by use of the composition, and electronic device
  申请人：Watanabe Yasufumi

  公开号：US20070255003A1

  公开（公告）日：2007-11-01

  A film forming composition includes a polymer of a compound represented by formula (I): wherein R 1 , R 2 and R 3 each independently represents a substituent containing a carbon-carbon double bond or carbon-carbon triple bond; X 1 , X 2 and X 3 each independently represents any substituent; l and n each stands for an integer of from 0 to 15 and m stands for an integer of from 0 to 14, with the proviso that l, m and n do not represent 0 simultaneously; o and q each independently stands for an integer of from 0 to 15 and p independently stands for an integer of from 0 to 14; and r stands for 0 or 1, with the proviso that when r=0, R 1 and R 3 each independently represents a substituent containing a carbon-carbon double bond.

  一种膜形成组合物包括化合物的聚合物，该化合物由式（I）表示：其中R1，R2和R3各自独立地表示含有碳-碳双键或碳-碳三键的取代基；X1，X2和X3各自独立地表示任何取代基；l和n分别表示从0到15的整数，m表示从0到14的整数，但是具有l，m和n不能同时表示0的限定条件；o和q各自独立地表示从0到15的整数，p独立地表示从0到14的整数；r表示0或1，但是具有当r=0时，R1和R3各自独立地表示含有碳-碳双键的取代基的限定条件。
• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES
  申请人：MATSUTANI Mihoko

  公开号：US20090318610A1

  公开（公告）日：2009-12-24

  There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-VW n Y  (1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

  提供了有机绝缘材料，具有低介电常数、高耐热性和高机械强度，以及采用相同材料的低介电常数、高耐热性和高机械强度的有机绝缘膜，以及包括上述材料的半导体器件。有机绝缘材料包括由通式（1）表示的化合物、由通式（1）表示的化合物聚合得到的聚合物，或通式（1）表示的化合物和聚合物的混合物。X和Y各自独立表示具有可聚合功能基团的一个或多个基团。V和W分别表示具有金刚烷或聚金刚烷结构的基团，它们可以相同也可以不同。字母n表示大于等于0的整数。
• Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device
  申请人：Enoki Takashi

  公开号：US20080206548A1

  公开（公告）日：2008-08-28

  A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

  一种苯并噁唑树脂前体，包括第一重复单元，该单元由双氨基酚化合物和二羧酸化合物反应得到，其中至少一个具有金刚烷结构；一种苯并噁唑树脂前体，进一步包括第二重复单元，该单元由不具有金刚烷结构的双氨基酚化合物和不具有金刚烷结构的二羧酸化合物反应得到；通过上述苯并噁唑树脂前体的环合反应和脱水反应得到的聚苯并噁唑树脂；由苯并噁唑树脂前体或聚苯并噁唑树脂构成的树脂膜。可以从苯并噁唑树脂前体中获得具有优异耐热性和小介电常数的聚苯并噁唑树脂和树脂膜，以及使用树脂膜的半导体器件。
• ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
  申请人：Sano Yohko

  公开号：US20100004379A1

  公开（公告）日：2010-01-07

  The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

  本发明提供了有用的有机绝缘材料，具有低介电常数、高耐热性和高机械强度，以及采用它们的树脂薄膜和半导体器件。本发明的有机绝缘材料包括具有可聚合不饱和键含基团的金刚烷结构化合物的预聚物。根据凝胶渗透色谱法，预聚物的数均分子量在聚苯乙烯基础上为2,000至500,000之间。可聚合不饱和键含基团最好是含有碳-碳三键的基团。本发明的树脂薄膜是通过加热和/或活性辐射以及缩合反应交联反应有机绝缘材料或含有它们的树脂薄膜漆制得的。