聚合物/大分子半导体砌块
中文名称 | 英文名称 | CAS号 | 化学式 | 分子量 |
---|---|---|---|---|
—— | N,N-bis(p-tolylsulfonyl)hydroxylamine | 56410-24-3 | C14H15NO5S2 | 341.409 |
对甲苯磺酰胺 | toluene-4-sulfonamide | 70-55-3 | C7H9NO2S | 171.22 |
对甲苯磺酰叠氮 | 4-toluenesulfonyl azide | 941-55-9 | C7H7N3O2S | 197.217 |
中文名称 | 英文名称 | CAS号 | 化学式 | 分子量 |
---|---|---|---|---|
—— | 4-methyl-N-(2-oxopropyl)-N-tosylbenzenesulfonamide | 1563129-13-4 | C17H19NO5S2 | 381.474 |
—— | 4-methyl-N-(phenylethynyl)-N-tosylbenzenesulfonamide | 1397689-44-9 | C22H19NO4S2 | 425.529 |
—— | 4-methyl-N-phenyl-N-tosylbenzenesulfonamide | 5667-64-1 | C20H19NO4S2 | 401.507 |
—— | 4-methyl-N-(2-methylenepentyl)-N-tosylbenzenesulfonamide | 1374016-34-8 | C20H25NO4S2 | 407.555 |
—— | 4-methyl-N-(3-methyl-2-methylenebutyl)-N-tosylbenzenesulfonamide | 1374016-38-2 | C20H25NO4S2 | 407.555 |
—— | (E)-4-methyl-N-(2-methylpent-2-en-1-yl)-N-tosylbenzenesulfonamide | 1374016-33-7 | C20H25NO4S2 | 407.555 |
—— | N-[(Z)-4-[bis-(4-methylphenyl)sulfonylamino]-3-methylbut-2-enyl]-4-methyl-N-(4-methylphenyl)sulfonylbenzenesulfonamide | 1379606-35-5 | C33H36N2O8S4 | 716.921 |
—— | (E)-N,N'-(2-methylbut-2-ene-1,4-diyl)bis(4-methyl-N-tosylbenzenesulfonamide) | 1379606-21-9 | C33H36N2O8S4 | 716.921 |
—— | 4-methyl-N-(2-methylenehex-3-yn-1-yl)-N-tosylbenzenesulfonamide | 1374016-40-6 | C21H23NO4S2 | 417.55 |
—— | (Z)-N,N'-(2,3-dimethylbut-2-ene-1,4-diyl)bis(4-methyl-N-tosylbenzenesulfonamide) | 1379606-37-7 | C34H38N2O8S4 | 730.948 |