METHOD OF MODIFYING SURFACE LAYER OF MOLDED RESIN AND APPARATUS FOR MODIFYING SURFACE LAYER OF MOLDED RESIN
申请人:Japan as represented by Secretary of Agency of Industrial Science and Technology
公开号:EP1179558A1
公开(公告)日:2002-02-13
An organic compound having an affinity for a resin of a molded resin article and sublimation properties is allowed to penetrate/disperse into the surface of the molded resin article, thereby modifying and/or coloring a resin surface layer. The molded resin article and the organic compound having the affinity for the resin and the sublimation properties are put into a tightly closable container, and the pressure and the temperature in the container are adjusted to place them in a saturated sublimation pressure state of the organic compound, whereby a vapor of the organic compound is uniformly deposited on the surface of the molded resin article and it further penetrates/disperses into the resin surface layer, and in consequence, the resin surface layer can be modified and/or colored. In addition, the modification of the resin surface layer permits imparting a function thereto.
Modification method of surface layer of molded resin article, and modification apparatus of surface layer of molded resin article
申请人:National Institute of Advanced Industrial Science
and Technology
公开号:EP1944332A2
公开(公告)日:2008-07-16
A modification method of the surface layer of a molded resin article which comprises the steps of:
placing, in a first closed space, an organic compound having sublimation properties and an affinity for a resin of a molded resin article to be coated;
on the other hand, placing the molded resin article in a second closed space;
controlling a temperature in the second closed space so as to be equal to or higher than the temperature in the first closed space;
bringing a pressure in the first closed space to a saturated sublimation pressure state of the organic compound;
controlling a pressure in the second closed space so as to be equal to or lower than the pressure in the first closed space;
subsequently, connecting the first closed space to the second closed space to form a third closed space in which the first closed space is combined with the second closed space, and further controlling the temperature and the pressure so that the whole of the third closed space may be in the saturated sublimation pressure state of the organic compound;
allowing a vapor of the organic compound with which the first closed space before the connection is filled to diffuse into the second closed space before the connection;
uniformly depositing the vapor of the organic compound on the surface of the molded resin article; and
allowing the deposited organic compound to penetrate/disperse from the surface of the molded resin article into its inside.