申请人:Hitachi Chemical Company, Ltd.
公开号:US10946494B2
公开(公告)日:2021-03-16
A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.
一种用于抛光树脂的抛光剂由磨粒、具有醚键的水溶性聚合物、有机溶剂和水组成,其中磨粒在抛光剂中带有正电荷,磨粒的平均颗粒直径大于 20 纳米。