申请人:Tokyo Ohka Kogyo Co., Ltd.
公开号:EP3275940A1
公开(公告)日:2018-01-31
The present invention provides an energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. Also provided are a method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition comprises an imidazole compound (A) represented by formula (1a), a resin precursor component (B), and a solvent (S), wherein the resin precursor component (B) is at least one resin precursor component selected from the group consisting of: a monomer component comprising a diamine compound represented by formula (2), a dicarbonyl compound represented by formula (3a) and/or a tetracarboxylic acid dianhydride represented by formula (3b); and a precursor polymer having a repeating unit represented by formula (4).
本发明提供了一种能量敏感树脂组合物,使用该组合物,即使在低温下对前体聚合物进行热处理,也可以生产出一种薄膜或模塑制品,该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成,或由具有优异耐热性、拉伸伸长率和耐化学性的含恶唑环聚合物组成。此外,还提供了一种制造薄膜或模塑品的方法;一种使用能量敏感树脂组合物形成图案的方法;以及一种具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括由式 (1a) 表示的咪唑化合物 (A)、树脂前体组分 (B) 和溶剂 (S),其中树脂前体组分 (B) 是至少一种选自以下组别的树脂前体组分:由式(2)代表的二胺化合物、式(3a)代表的二羰基化合物和/或式(3b)代表的四羧酸二酐组成的单体组分;以及具有式(4)代表的重复单元的前体聚合物。