2-Methylpropanal;propan-2-one | 90529-51-4

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2-Methylpropanal;propan-2-one
• CAS: 90529-51-4
• 化学式: C7H14O2
• 分子量: 130.18
• InChiKey: IZGFQHXVNPKRBO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.44
• 重原子数：
  9
• 可旋转键数：
  1
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.71
• 拓扑面积：
  34.1
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• CROSSLINKED SILSESQUIOXANE RANDOM COPOLYMERS ABSORBING BOTH UVA AND UVB AND METHOD FOR PREPARING THE SAME
  申请人：NANO AND MICRO TECHNOLOGIES CO., LTD.

  公开号：US20190202994A1

  公开（公告）日：2019-07-04

  The present invention relates to crosslinked silsesquioxane random copolymers absorbing both UVA and UVB although they contain only UVB absorbing chromophores, and methods preparing the same. Crosslinked polysilsesquioxane random copolymers prepared by the method of the present invention have good sensory and are safe as they are not absorbed into human body due to their high molecular weights. These polymers have desirable UV blocking function as they absorb wider range of UV including both UV B (280-320 nm) and UV A (320-400 nm) by excimer or exciplex formation between chromophores. Also, these polymers are useful for UV blocking cosmetics as they do not develop opaque white appearance in high concentration (30%).

  本发明涉及交联的聚硅氧烷随机共聚物，尽管它们仅含有UVB吸收色团，但能吸收UVA和UVB，以及其制备方法。通过本发明方法制备的交联聚硅氧烷随机共聚物具有良好的感官性能，由于其分子量高，因此安全，不会被人体吸收。这些聚合物具有理想的UV阻挡功能，因为它们通过色团之间的激基或激复合物形成吸收更广泛的UV范围，包括UV B（280-320 nm）和UV A（320-400 nm）。此外，这些聚合物在高浓度（30％）下不会产生不透明的白色外观，因此可用于UV阻挡化妆品。
• Processes for the preparation of substituted bicyclic derivatives
  申请人：Ripin H. B. David

  公开号：US20050026940A1

  公开（公告）日：2005-02-03

  The invention relates to processes for preparing compounds of the formula 1 and to pharmaceutically acceptable salts, prodrugs and solvates thereof, wherein R 1 , R 3 , R 4 , R 6 , R 11 , R 13 , R 14 , R 15 , R 16 , R 17 , k, l, and m are as defined herein. The compounds of formula 1 are useful intermediates toward preparing compounds that may be used in treating abnormal cell growth in mammals by administering pharmaceutical compositions.

  本发明涉及制备式1化合物的过程，以及其药学上可接受的盐、前药和溶剂化物，其中R1、R3、R4、R6、R11、R13、R14、R15、R16、R17、k、l和m的定义如本文所述。式1化合物是制备可用于治疗哺乳动物异常细胞生长的化合物的有用中间体，通过给药药物组合物。
• Thiazole derivatives with fungicidal activity
  申请人：Gusmeroli Marilena

  公开号：US20050065197A1

  公开（公告）日：2005-03-24

  Compounds having general formula (I) are described, together with their use for the control of phytopathogenic fungi.

  描述了具有通式（I）的化合物，以及它们用于控制植物病原真菌的用途。
• CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE
  申请人：Lee Wai Mun

  公开号：US20090130849A1

  公开（公告）日：2009-05-21

  A composition and associated method for chemical mechanical planarization (or other polishing) is described. The composition contains an amidoxime compound and water. The composition may also contain an abrasive and a compound with oxidation and reduction potential. The composition is useful for attaining improved removal rates for metal, including copper, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications.

  本文描述了一种化学机械平整化（或其他抛光）的组合物及其相关方法。该组合物含有一种酰胺肟化合物和水。该组合物还可以含有磨料和具有氧化还原潜力的化合物。该组合物可用于在金属CMP中获得改进的金属去除速率，包括铜、屏障材料和金属CMP中的介电层材料。该组合物在金属CMP应用的相关方法中特别有用。
• METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS
  申请人：Lee Wai Mun

  公开号：US20100043823A1

  公开（公告）日：2010-02-25

  The present invention relates to aqueous compositions comprising amidoxime compounds and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The compositions of the invention may optionally contain one or more other acid compounds, one or more basic compounds, and a fluoride-containing compound and additional components such as organic solvents, chelating agents, amines, and surfactants. The invention also relates to a method of removing residue from a substrate during integrated circuit fabrication.

  本发明涉及含有酰胺肟化合物的水性组合物及其清洗半导体衬底上等离子体刻蚀残留物的方法，包括这种稀释的水性溶液。本发明的组合物可以选择性地含有一种或多种其他酸性化合物、一种或多种碱性化合物、含氟化合物和其他成分，如有机溶剂、螯合剂、胺和表面活性剂。本发明还涉及一种在集成电路制造过程中从衬底上去除残留物的方法。