1-[2-(Hydroxymethyl)phenyl]propan-1-one | 219143-28-9

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 1-[2-(Hydroxymethyl)phenyl]propan-1-one
• CAS: 219143-28-9
• 化学式: C₁₀H₁₂O₂
• 分子量: 164.2
• InChiKey: SYKRJDYATXQKGB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  12
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.3
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

文献信息

• [EN] HETEROCYCLIC AMIDE COMPOUND AND USE THEREOF AS AN MMP-13 INHIBITOR<br/>[FR] COMPOSÉ AMIDE HETEROCYCLIQUE ET UTILISATION DE CELUI-CI EN TANT QU'INHIBITEUR MMP-13
  申请人：TAKEDA PHARMACEUTICAL

  公开号：WO2005105760A1

  公开（公告）日：2005-11-10

  The present invention provides a novel amide derivative having a matrix metalloproteinase inhibitory activity, and useful as a pharmaceutical agent, which is a compound represented by the formula (I) wherein ring A is an optionally substituted, nitrogen-containing heterocycle, ring B is an optionally substituted monocyclic homocycle or an optionally substituted monocyclic heterocycle, Z is N or NR1 (R1 is a hydrogen atom or an optionally substituted hydrocarbon group), - - - is a single bond or a double bond, R2 is a hydrogen atom or an optionally substituted hydrocarbon group, X is an optionally substituted spacer having 1 to 6 atoms, ring C is (1) an optionnally substituted homocycle or (2) an optionally substituted heterocycle other than a ring represented by (II) (X’ is S, O, SO, or CH2), and at least one of ring B and ring C has substituent(s), provided that N-(1S,2R)-1-(3,5-difluorobenzyl)-3-[(3-ethylbenzyl)amino]-2-hydroxypropyl}-5,6-dimethyl-4-oxo-1,4-dihadrothieno[2,3-d]pyrimidine-2-carboxamide is excluded, or a salt thereof.

  本发明提供了一种新型酰胺衍生物，具有基质金属蛋白酶抑制活性，并且作为药用剂是有用的，该化合物由以下式(I)表示，其中环A是一个可选择取代的含氮杂环，环B是一个可选择取代的单环同核环或可选择取代的单环杂环，Z是N或NR1（R1是氢原子或可选择取代的碳氢基团），- - - 是一个单键或双键，R2是氢原子或可选择取代的碳氢基团，X是具有1到6个原子的可选择取代的间隔物，环C是(1)一个可选择取代的同核环或(2)除了由(II)表示的环之外的可选择取代的杂环（X'是S、O、SO或CH2），并且环B和环C中至少有一个具有取代基，但不包括N-(1S,2R)-1-(3,5-二氟苄基)-3-[(3-乙基苄基)氨基]-2-羟基丙基}-5,6-二甲基-4-氧代-1,4-二氢噻吩[2,3-d]嘧啶-2-羧酰胺或其盐。
• HYDROPHILIC SILICONE COMPOSITION
  申请人：Bhat Shreedhar

  公开号：US20150158889A1

  公开（公告）日：2015-06-11

  A composition comprising a carbocyclic group and a hydrophilic moiety attached thereto an alpha, beta-unsaturated organosilicon compound. Such compounds are useful in developing water absorbing silicone-hydrogel films. Silicone-hydrogel films provide increased oxygen to pass through a lens or other treated materials.

  一种组成物包括一个含碳环基和一个亲水基团附着在α，β-不饱和有机硅化合物上。这样的化合物在开发吸水硅水凝胶薄膜方面非常有用。硅水凝胶薄膜能够提供更多的氧气穿过镜片或其他处理材料。
• POLYMERIZABLE AMIDO-CONTAINING ORGANOSILICON COMPOUNDS, SILICON-CONTAINING POLYMERS AND BIOMEDICAL DEVICES THEREFROM
  申请人：Saxena Anubhav

  公开号：US20150011670A1

  公开（公告）日：2015-01-08

  There is provided a fast curing composition comprising an alpha, beta-unsaturated amido-containing organosilicon compound, useful in making water absorbing silicone-hydrogel films for biomedical devices, such as contact lens, and a process for producing these monomers. This invention also provides for hydrogels made from the alpha, beta-unsaturated amido-containing organosilicon compound described herein.

  本发明提供了一种快速固化的组合物，包括一种含有α，β-不饱和酰胺的有机硅化合物，用于制造生物医学设备（如隐形眼镜）的吸水性硅-水凝胶膜，并提供了制造这些单体的过程。本发明还提供了由本文所述的α，β-不饱和酰胺含有的有机硅化合物制成的水凝胶。
• A heat-resistant photosensitive resin composition
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：EP0283990A2

  公开（公告）日：1988-09-28

  The heat-resistant photosensitive resin composition com­prises: (a) a copolymer of a monomer mixture composed of an acrylic amide monomer of the formula CH₂=CX-CO-NH-Y-OZ, in which X is H or methyl, Y is an alkylene group and Z is an alkyl group, a carboxyl-containing monomer, e.g., acrylic acid, and a third monomer; (b) an esterified resin derived from a novolac-type epoxy resin; (c) a photopolymerizable monomer, e.g., trimethylol propane tri­acrylate; (d) a photopolymerization initiator; (e) a powdery solid material, e.g., finely divided silica filler; and (f) a curing agent for epoxy resins.

  耐热感光树脂组合物包括 (a) 由式 CH₂=CX-CO-NH-Y-OZ 的丙烯酸酰胺单体（其中 X 为 H 或甲基，Y 为亚 烷基，Z 为烷基）、含羧基单体（如丙烯酸）和第三单体组成的单体混合物的共聚 物； (b) 由酚醛型环氧树脂衍生的酯化树脂； (c) 可进行光聚合的单体，如三羟甲基丙烷三丙烯酸酯； (d) 光聚合引发剂； (e) 粉末状固体材料，如细粒硅填料；以及 (f) 环氧树脂固化剂。
• Photosensitive, heat-resistant resin composition and pattern formation process
  申请人：FUJITSU LIMITED

  公开号：EP0453237A2

  公开（公告）日：1991-10-23

  The film forming, photosensitive, heat-resistant resin composition comprising a varnish of a polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized and a polymerization initiator for said monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting including multi-chip modules or the like, such as printed circuits, printed boards, wiring boards and electronic components, can effectively avoid a reduction of the layer thickness during the film formation, and ensures a low cost production process. The pattern formation process using the same resin composition is also disclosed.

  成膜、感光、耐热树脂组合物，包括本身无感光性的聚酰亚胺前体清漆、与所述清漆相容且聚合后能形成高耐热聚合物的可聚合单体或低聚物以及所述单体或低聚物的聚合引发剂。该树脂组合物适用于生产电路基板和高密度安装的半导体器件，包括多芯片模块或类似器件，如印刷电路、印刷板、配线板和电子元件，可有效避免在成膜过程中减少层厚度，并确保低成本生产工艺。此外，还公开了使用相同树脂组合物的图案形成工艺。