2,4-dichloro-5-ethylimidazole | 50455-28-2

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 2,4-dichloro-5-ethylimidazole
• 英文别名: 2,4-Dichloro-5-ethyl-1H-imidazole
• CAS: 50455-28-2
• 化学式: C₅H₆Cl₂N₂
• 分子量: 165.022
• InChiKey: PJGPQOXWPYYELJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  9
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2,4-dichloro-5-ethylimidazole 在 3-己酮 、 sodium iodide 作用下， 以58.3%的产率得到2-chloro-4-ethylimidazole
  参考文献：
  名称：

  METHOD FOR PRODUCING 2-HALOIMIDAZOLE COMPOUND

  摘要：

  公开号：

  EP2141151B1

文献信息

• Thermosetting resin composition for semiconductor package and prepreg using the same
  申请人：LG CHEM, LTD.

  公开号：US10294341B2

  公开（公告）日：2019-05-21

  The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

  本发明涉及一种半导体封装用热固性树脂组合物和使用该组合物的预浸料。具体而言，本发明提供了一种用于半导体封装的热固性树脂组合物，该组合物通过引入丙烯酸橡胶，并将两种特定的无机填料以一定比例与特定组合物的粘结剂进行表面处理后混合，从而显示出较低的固化收缩率和较高的玻璃化转变温度，并大大提高了流动性，同时还提供了使用该组合物的预浸料。
• Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same
  申请人：LG CHEM, LTD.

  公开号：US11535750B2

  公开（公告）日：2022-12-27

  There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

  本文提供了一种半导体封装用热固性树脂组合物，以及使用该组合物的预浸料和金属包覆层压板。更具体地说，本发明提供了一种半导体封装用热固性树脂组合物，该组合物通过在基于环氧树脂的热固性树脂组合物中使用氰酸酯类树脂和苯并恶嗪树脂来改善脱膜特性，并通过使用浆料型填料来改善耐化学性，从而具有高耐热性和可靠性，还提供了使用该组合物的预浸料和金属铠装层压板。
• CURE INHIBITED EPOXY RESIN COMPOSITIONS AND LAMINATES PREPARED FROM THE COMPOSITIONS
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0729484B1

  公开（公告）日：2000-03-01
• THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE USING THE SAME
  申请人：Shim Hee-Yong

  公开号：US20130319609A1

  公开（公告）日：2013-12-05

  The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.
• THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND PREPREG AND METAL CLAD LAMINATE USING THE SAME
  申请人：LG CHEM, LTD.

  公开号：US20160369099A1

  公开（公告）日：2016-12-22

  There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.