(B-podands) were studied as strong complexing agents of alkali metal cations and very powerful catalysts in typical anion promoted reactions under solid–liquid conditions, even in chlorobenzene and acetonitrile. The results were comparable with the catalytic activity of classical phasetransfercatalysts: crown ethers, polyethylene glycols (PEG) and previously studied Si-podands.
Thiocarbonate compounds which, in one embodiment, are utilized as a rheology modifier or associative thickener. The thiocarbonate compounds thicken or increase the viscosity of a composition, preferably an aqueous composition when used in an effective amount. In one preferred embodiment, the thiocarbonate compounds include at least one hydrophilic group containing repeat unit such as derived from acrylic acid, and at least one hydrophobic group to enhance association with other compounds and thus increase viscosity of a composition. Aqueous composition comprising a latex and thiocarbonate associative thickeners are described.
Pasty preparation for reactive printing, containing at least
A) a thickener based on polysaccharides
B) an additive selected from the group consisting of
B1) the saturated and/or unsaturated ethoxylated fatty alcohols, fatty amines and fatty acids having a degree of alkoxylation of 6 to 20
and/or the group consisting of
B2) alkyl(oligo)glycosides of the formula R-O[G]p where R is a saturated or unsaturated alkyl radical of 1 to 6 carbon atoms, G is a glycoside radical and p is from 1 to 10,
C) a reactive dye and
D) an alkaline colour fixative.
用于活性印刷的糊状制剂,至少含有
A) 基于多糖的增稠剂
B) 选自以下组别的添加剂
B1) 烷氧基化程度为 6 至 20 的饱和和/或不饱和乙氧基化脂肪醇、脂肪胺和脂肪酸
和/或由以下物质组成的组
B2) 式 R-O[G]p 的烷基(低聚)糖苷,其中 R 为 1 至 6 个碳原子的饱和或不饱和烷基,G 为糖苷基,p 为 1 至 10、
C) 活性染料和
D) 一种碱性固色剂。
Slurry composition for chemical mechanical polishing
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US10428242B2
公开(公告)日:2019-10-01
A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same
申请人:Samsung Electronics Co., Ltd.
公开号:US10829690B2
公开(公告)日:2020-11-10
Disclosed is a slurry composition for chemical mechanical polishing (CMP) includes, as polishing particles, a complex compound of both fullerenol and alkylammonium hydroxide. The slurry composition, which exhibits excellent polishing properties, may be prepared at low cost in large quantities. Also disclosed is a method of preparing the slurry composition comprising obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene, removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles to the mixture, separating the hydrogen peroxide decomposition catalyst particles from the mixture by filtration, and adding a polishing additive to the mixture. Further disclosed is a method of fabricating a semiconductor device that includes providing a pattern defining a trench, forming a metal material film on the pattern to fill the trench, and performing CMP of the metal material film using the slurry composition.