CROSSLINKING AGENT, NEGATIVE RESIST COMPOSITION, AND PATTERN FORMING METHOD USING THE NEGATIVE RESIST COMPOSITION
申请人:Okuyama Kenichi
公开号:US20120115084A1
公开(公告)日:2012-05-10
Disclosed are a negative resist composition which shows excellent sensitivity and resolution in pattern formation by exposure to electron beams or EUV, a novel crosslinking agent suitable for the resist composition, and a pattern forming method using the resist composition.
The negative resist composition comprises: (A) a polyphenol compound comprising two or more phenolic hydroxyl groups in a molecule thereof and having a molecular weight of 300 to 3,000, (B) an acid generator which directly or indirectly produces acid by exposure to active energy rays having a wavelength of 248 nm or less, and (C) a crosslinking agent represented by the following chemical formula (1).
(The symbols shown in the formula (1) are defined in the Description).
The present invention has its object to provide a photoradical- and photocation-curable composition improved in curability.
The present invention relates to
a photoradical- and photocation-curable composition which comprises:
(A) a vinyl polymer having, per molecule, two or more groups represented by the general formula (1):
-OC(O)C(Ra)=CH2 (1)
wherein Ra represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, at least one of which groups occurs at a molecular terminus, and
(B) an epoxy compound and/or oxetane compound and that the N atom-containing compound concentration in the component (A) is not higher than 1,000 ppm and the N atom-containing compound concentration relative to the component (B) is not higher than 2,300 ppm.
本发明的目的是提供一种可提高固化性的光降解和光致发光固化组合物。
本发明涉及
一种光致抗坏和光致脱落固化组合物,它包括
(A) 乙烯基聚合物,每个分子具有两个或两个以上由通式(1)表示的基团:
-OC(O)C(Ra)=CH2(1)
其中 Ra 代表氢原子或含有 1 至 20 个碳原子的有机基团,其中至少一个基团位于分子末端,以及
(B) 环氧化合物和/或氧杂环丁烷化合物,且组分 (A) 中含 N 原子化合物的浓度不高于 1,000 ppm,相对于组分 (B) 含 N 原子化合物的浓度不高于 2,300 ppm。
SILICA-INCLUDING MICROCAPSULE RESIN PARTICLES, METHOD FOR PRODUCING SAME, AND APPLICATION THEREOF
申请人:Sekisui Plastics Co., Ltd.
公开号:EP3424486A1
公开(公告)日:2019-01-09
Silica-including microcapsule resin particles including an outer shell constituted of a crosslinked polymer and a cavity partitioned with the outer shell, in which the silica-including microcapsule resin particles contain inside the cavity a porous structure in which silica particles are mutually connected, and have a volume average particle diameter of 0.5 to 100 µm.
NOVEL COMPOUND HAVING ISOCYANURIC SKELETON AND COMPOSITION IN WHICH SAID COMPOUND IS INCLUDED
申请人:Daikin Industries, Ltd.
公开号:EP3498756A1
公开(公告)日:2019-06-19
The invention aims to provide a novel compound to be suitably used for antifouling agents. The compound of the invention is represented by the following formula (1):
wherein R1 is a monovalent organic group containing a polyether chain; X1 and X2 are each individually a monovalent group; and the polyether chain is a chain represented by the following formula: -(OC6F12)m11-(OC5F10)m12-(OC4F8)m13-(OC3X106)m14-(OC2F4)m15-(OCF2)m16-, wherein m11, m12, m13, m14, m15, and m16 are each individually an integer of 0 or 1 or greater; X10s are each individually H, F, or Cl; and the repeating units are present in any order.
The invention provides a functional film that has a desired microrelief pattern structure, that sufficiently exerts characteristics of a resin serving as a main component for imparting functions to the functional film, and that has an excellent antifouling property, water-repellency, and oil-repellency. The functional film includes a layer (A) that contains a resin and a layer (B) that contains a compound containing a perfluoropolyether group. The layer (B) has a microrelief pattern structure on a surface remote from the layer (A) . In elemental analysis by X-ray photoelectron spectroscopy with etching by an argon gas cluster ion beam from the layer (B) side, the functional film satisfies the following formula (1): D1 < 2 × X1, wherein X1 is a thickness (nm) of the layer (B); and D1 is a depth (nm) at which fluorine atoms exhibit a concentration of 1 atom% or lower. In carbon 1s spectrum measurement by X-ray photoelectron spectroscopy with etching by an argon gas cluster ion beam from the layer (B) side, the functional film satisfies the following formula (2): D2 < 2 × X1, wherein X1 is the thickness (nm) of the layer (B); and D2 is a depth (nm) at which no peak is detected within a bond energy range of 290 to 300 eV.