Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film
申请人:FUJIFILM CORPORATION
公开号:US10248019B2
公开(公告)日:2019-04-02
A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.
Pattern forming method, composition kit and resist film, manufacturing method of electronic device using these, and electronic device
申请人:FUJIFILM Corporation
公开号:US10031419B2
公开(公告)日:2018-07-24
There is provided a pattern forming method comprising (i) forming a film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a resin which decomposes due to an action of an acid to change its solubility with respect to a developer and (C) a specific resin, (ii) forming a top coat layer using a top coat composition which contains a resin (T) on the film, (iii) exposing the film which has the top coat layer to actinic rays or radiation, and (iv) forming a pattern by developing the film which has the top coat layer after the exposing.
Polyphenylene sulfide block copolymer, method for manufacturing same, and method for manufacturing polyphenylene sulfide porous body
申请人:TORAY INDUSTRIES, INC.
公开号:US10040910B2
公开(公告)日:2018-08-07
A heat-resistant, chemical-resistant polyphenylene sulfide block copolymer containing polyphenylene sulfide units and aromatic polyester units, wherein the polyphenylene sulfide units have a number average molecular weight in the range of 6,000 to 100,000. Provided is a polyphenylene sulfide block copolymer that overcomes the disadvantages of block copolymers including a low-molecular-weight polyphenylene sulfide segment and having poor heat resistance and chemical resistance.
PATTERN FORMING METHOD, COMPOSITION KIT AND RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THESE, AND ELECTRONIC DEVICE
申请人:FUJIFILM Corporation
公开号:US20160048075A1
公开(公告)日:2016-02-18
There is provided a pattern forming method comprising (i) forming a film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a resin which decomposes due to an action of an acid to change its solubility with respect to a developer and (C) a specific resin, (ii) forming a top coat layer using a top coat composition which contains a resin (T) on the film, (iii) exposing the film which has the top coat layer to actinic rays or radiation, and (iv) forming a pattern by developing the film which has the top coat layer after the exposing.
PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK
申请人:FUJIFILM Corporation
公开号:US20170121437A1
公开(公告)日:2017-05-04
A pattern forming method includes forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, exposing the film with active light or radiation, and developing the exposed film using a developer including an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a compound having a partial structure represented by General Formula (I).