A curable resin composition comprising:
(A) an epoxy component containing (A-1) from 5 to 100 percent by weight of at least one epoxy resin having an average of not more than two vicinal epoxy groups per molecule and (A-2) from 95 to zero percent of at least one epoxy group having an average of more than two vicinal epoxy groups per molecule;
(B) a phenolic hydroxyl group-containing component containing (B-1) from 5 to 100 percent by weight of at least one phenolic hydroxyl-containing compound having an average of not more than two phenolic hydroxyl groups per molecule and (B-2) from 95 to zero percent by weight of at least one phenolic hydroxyl-containing
compound having an average of more than two phenolic hydroxyl groups per molecule;
(C) at least one curing agent; wherein Components (A) and (B) are present in quantities which provide a ratio of epoxy groups to phenolic hydroxyl groups of from 1:0.83 to 1:0.007, is disclosed. A laminating varnish comprising the above resin composition, an electrical laminate prepared therefrom and a process for preparation of electrical laminates, are also disclosed.
一种可固化
树脂组合物,包括
(A) 环氧组分,含有(A-1)5%至100%(按重量计)的至少一种环氧
树脂,其每分子平均具有不超过两个邻接环氧基团,以及(A-2)95%至0%的至少一种环氧基团,其每分子平均具有超过两个邻接环氧基团;
(B) 含
酚羟基组分,其中(B-1)至少一种含
酚羟基化合物的重量百分比为 5%至 100%,该化合物平均每分子中含有不超过两个
酚羟基;(B-2)至少一种含
酚羟基化合物的重量百分比为 95%至零,该化合物平均每分子中含有超过两个
酚羟基;(B-3)至少一种含
酚羟基化合物的重量百分比为 95%至零,该化合物平均每分子中含有超过两个
酚羟基。
(B-2) 至少一种含
酚羟基化合物的重量百分比为 95%至零,该化合物每分子平均具有两个以上的
酚羟基;
(C) 至少一种固化剂;其中组分(A)和(B)的存在量使环氧基团与
酚羟基的比例为 1:0.83 至 1:0.007。此外,还公开了由上述
树脂组合物组成的层压清漆、由其制备的电气层压板以及制备电气层压板的工艺。