4,4'-oxybis[(4-(4-aminophenoxy)phenoxy)]benzene

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-oxybis[(4-(4-aminophenoxy)phenoxy)]benzene
• 英文别名: 4-[4-[4-[4-[4-(4-Aminophenoxy)phenoxy]phenoxy]phenoxy]phenoxy]aniline
• 化学式: C₃₆H₂₈N₂O₅
• 分子量: 568.629
• InChiKey: ZOSHHBZULVQMJV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.5
• 重原子数：
  43
• 可旋转键数：
  10
• 环数：
  6.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  98.2
• 氢给体数：
  2
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  4,4'-二羟基联苯 在 5%-palladium/activated carbon 、 potassium carbonate 、 一水合肼 、 间氯过氧苯甲酸 、 potassium hydroxide 作用下， 以 甲醇 、 氯仿 、 N,N-二甲基乙酰胺 、 N,N-二甲基甲酰胺 为溶剂， 反应 36.5h， 生成 4,4'-oxybis[(4-(4-aminophenoxy)phenoxy)]benzene
  参考文献：
  名称：

  Thermal transition behaviors, solubility, and mechanical properties of wholly aromatic para-, meta-poly(ether-amide)s: effect on numbers of para-aryl ether linkages

  摘要：

  含有2、3、4或5个对芳基醚连接的para-和meta-聚醚酰胺具有不同的溶解性、热转变行为和机械性能。

  DOI：

  10.1039/c6ra11163g

文献信息

• OLIGOMERS WITH DI-PHENYLETHYNYL ENDCAPS
  申请人：Tsotsis Thomas K.

  公开号：US20100204412A1

  公开（公告）日：2010-08-12

  An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D wherein D is a di-phenylethynyl endcap; and A is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.

  公开了一种具有二苯乙炔端基的寡聚物。带端基的寡聚物的化学式为：D-A-D，其中D是二苯乙炔端基；A是从亚砜酸酐、醚、醚砜、酰胺、酰亚胺、酯、酯砜、醚亚胺、酰胺亚胺、噁唑、噁唑砜、噻唑、噻唑砜、咪唑和咪唑砜组成的寡聚物。
• POLYACETYLINIC OLIGOMERS
  申请人：Tsotsis Thomas K.

  公开号：US20100204485A1

  公开（公告）日：2010-08-12

  Polyacetylinic oligomers suitable for high-temperature polymer-matrix composites are provided. The polyacetylinic oligomers have the formula: D-A-D wherein D is an endcap including at least one crosslinking functionality; and A is backbone selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone. At least one ethynyl functional group, however, is incorporated into the backbone such that crosslinking is not only realized at the endcaps but also at the ethynyl groups within the backbone of the oligomer itself.

  提供适用于高温聚合物基复合材料的聚乙炔寡聚体。该聚乙炔寡聚体具有以下公式：D-A-D，其中D是至少包括一个交联功能的末端盖；而A是从亚砜酰胺、醚、醚砜、酰胺、亚酰胺、酯、酯砜、醚亚酰胺、酰胺亚酰胺、噁唑、噁唑砜、噻唑、噻唑砜、咪唑和咪唑砜组成的主链。但是，至少一个乙炔官能团被并入到主链中，使得交联不仅在末端盖处实现，而且在寡聚体本身的主链中的乙炔基团处也能实现交联。
• ADHESIVE RESIN COMPOSITION AND ADHESIVE AGENT IN FILM FORM, AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1624038B1

  公开（公告）日：2008-06-11
• EP1624038A1
  申请人：——

  公开号：EP1624038A1

  公开（公告）日：2006-02-08
• Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
  申请人：Kodama Youichi

  公开号：US20060281872A1

  公开（公告）日：2006-12-14

  The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.