壬烷-1-酸戊酯 | 61531-45-1

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 中文名称: 壬烷-1-酸戊酯
• 英文名称: nonanoic acid pentyl ester
• 英文别名: Nonansaeure-pentylester；pentyl nonan-1-oate；Amyl nonanoate；pentyl nonanoate
• CAS: 61531-45-1
• 化学式: C₁₄H₂₈O₂
• 分子量: 228.375
• InChiKey: DZOQJRHASSOUOU-UHFFFAOYSA-N

物化性质

• 熔点：
  -27°C
• 沸点：
  270.19°C (estimate)
• 密度：
  0.8506
• LogP：
  5.880 (est)
• 保留指数：
  1574

计算性质

• 辛醇/水分配系数(LogP)：
  5.4
• 重原子数：
  16
• 可旋转键数：
  12
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.93
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

安全信息

• 海关编码：
  2915900090

反应信息

• 作为产物：
  描述：

  戊醇 、 壬酸 在 对甲苯磺酸 、 苯 作用下， 生成 壬烷-1-酸戊酯
  参考文献：
  名称：

  Some Esters of Normal Aliphatic Alcohols and Acids¹

  摘要：

  DOI：

  10.1021/ja01248a044

文献信息

• REMOVING SOLUTION
  申请人：Daikin Industries, Ltd.

  公开号：EP1536291A1

  公开（公告）日：2005-06-01

  The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.

  本发明提供了一种用于低 K 薄膜的抗蚀剂去除溶液和一种用于通孔或电容器的清洁溶液，这些溶液包括氟化氢（HF）和至少一种从有机酸和有机溶剂组成的组中选出的成员。本发明还提供了一种使用这些溶液去除抗蚀剂的方法和清洗通孔或电容器的方法。
• COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3569329A1

  公开（公告）日：2019-11-20

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 µm and less than or equal to 0.8 µm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 µm and less than or equal to 50 µm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300°C, and a content of the solvent having a boiling point of higher than or equal to 300°C is greater than or equal to 2 mass% on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜浆料是一种用于无压粘接的铜浆料，包含：金属颗粒；以及一种分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于0.01微米且小于或等于0.8微米的亚微型铜颗粒，以及体积平均颗粒直径大于或等于2.0 µm且小于或等于50 µm，分散介质中含有沸点高于或等于300°C的溶剂，且沸点高于或等于300°C的溶剂的含量大于或等于无压键合用铜浆总质量的2%。
• Copper paste for pressureless bonding, bonded body and semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10930612B2

  公开（公告）日：2021-02-23

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜膏是一种用于无压粘接的铜膏，包含：金属颗粒；和分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于 0.01 μm 且小于或等于 0.8 μm 的亚微型铜颗粒，以及体积平均颗粒直径大于或等于 2.0 μm 且小于或等于 50 μm 的微型铜颗粒，分散介质包含沸点高于或等于 300°C 的溶剂、沸点高于或等于 300 摄氏度的溶剂的含量大于或等于无压接合铜浆总质量的 2%。
• Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US11370066B2

  公开（公告）日：2022-06-28

  Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 ηm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

  提供了一种用于接缝的金属浆料，其中包含：金属颗粒；以及具有 1 至 9 个碳原子的一价羧酸，其中金属颗粒包括体积平均颗粒直径为 0.12 μm 至 0.8 ηm 的亚微型铜颗粒，并且具有 1 至 9 个碳原子的一价羧酸的含量相对于 100 重量份的金属颗粒为 0.015 重量份至 0.2 重量份。
• Esters
  申请人：Unilever Home & Personal Care USA, Division of Conopco Inc.

  公开号：US20020076385A1

  公开（公告）日：2002-06-20

  Cellobiose esters and particularly &agr; cellobiose octanonanoate has been found able to structure water-immiscible liquids well, and in particular can produce clear structured emulsions. However, such emulsions tend to lose clarity or structural strength during storage. Deviating from &agr;-cellobiose octanonanoate can result in impaired clarity and/or impaired hardness of emulsion sticks. However, acylated cellobiose which contains acyl substituents of formula —O—CO—R in which R represents an n-octyl residue and the percentage Y of the nonanoate acyl substituent —O—CO—R at the anomeric carbon is at least 60% and the percentage A of &agr; anomer is greater than the anomer and not higher than A=74.5 +0.2Y when Y is up to 92% and not higher than A=161−0.74Y when Y is greater than 92% offers the production of sticks combining structurant stability with product clarity and hardness.

  研究发现，纤维生物糖酯，尤其是辛壬酸纤维生物糖酯，能够很好地构造水不相溶液体，特别是能够产生结构清晰的乳液。然而，这种乳液在储存过程中往往会失去透明度或结构强度。偏离丙烯酸纤维素辛壬酸酯会导致乳剂的透明度降低和/或硬度下降。 然而，含有式 -O-CO-R 的酰基取代基的酰化纤维生物糖，其中 R 代表正辛基残基，且壬酸酰基取代基 -O-CO-R 在异构碳上的百分比 Y 至少为 60%，&agr;异构体的百分比 A 大于异构体且不高于 A=74.5 +0.2Y（当 Y 达 92%时）和不高于 A=161-0.74Y（当 Y 大于 92%时）可生产出兼具结构稳定、产品透明度和硬度的棒材。

表征谱图