A room temperature curing resin compound that can be used as a potting material, which comprises
(A) an organic polymer comprising a main chain polymeric portion (a) having a molecular weight of 300 to 30,000 and having carbon-carbon double bonds of an iodine value of 50 to 500 and an acid group (b) linked to the main chain polymeric portion, the acid group being of a general formula
and being contained in a ratio of 0.05 to 0.5 mole per 100 g of component (A),
(B) a polyol having at least two hydroxyl groups in one molecule, and
(C) a curing promoter,
the ratio of the acid group (b) of component (A) and the hydroxyl group of (B) being 0.5 to 1.5, with or without the addition of a plasticizer.
一种可用作灌封材料的室温固化
树脂化合物,它包括
(A) 有机聚合物,包括分子量在 300 至 30000 之间、具有
碘值在 50 至 500 之间的碳碳双键的主链聚合物部分(a)和与主链聚合物部分相连的酸基(b),酸基的通式为
并以每 100 克组分(A)0.05 至 0.5 摩尔的比例含有、
(B) 在一个分子中至少含有两个羟基的多元醇,以及
(C) 固化
促进剂、
成分(A)的酸基(b)和(B)的羟基的比例为 0.5 至 1.5,可添加或不添加
增塑剂。