The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100° C above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, TUV; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, TΔ. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, TS, wherein TS is equal to or lower than TUV, and TUV is at least about 50° C lower than TΔ.
本发明涉及一种非辐射性双峰固化聚合物网络,它的起始降解温度比基础聚合物的起始降解温度高出约 100 摄氏度。新型固化聚合物网络包括以下成分的固化反应产物:(a) 一种或多种液态载体单体或预聚合物的组合,该组合在紫外线光敏剂存在下,在 TUV 温度下暴露于紫外线(UV)辐射中,可反应形成基础聚合物;以及 (b) 基于成分(a)的约 10 至 100 wt-%的一种或多种单体或预聚合物的组合,该组合在 TΔ 温度下加热,可反应形成固化的高温稳定聚合物。成分(b)在温度
TS 下可溶于或分散于成分(a),其中
TS 等于或低于 TUV,TUV 至少比 TΔ 低约 50℃。