氯磺酚S | 2103-73-3

• 物质功能分类: 有机原料 - 醇、酚、酚醇类化合物及衍生物 - 酚及其卤化、磺化、硝化或亚硝化衍生物
• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 中文名称: 氯磺酚S
• 中文别名: 氯代磺酚C；氯代磺酚S
• 英文名称: sulfochlorophenol C
• 英文别名: 3,6-bis[(5-chloro-2-hydroxy-3-sulfophenyl)azo]-4,5-dihydroxynaphthalene-2,7-disulfonic acid；sulfochlorophenol S；Sulfochlorophenol S；3,6-bis[(5-chloro-2-hydroxy-3-sulfophenyl)diazenyl]-4,5-dihydroxynaphthalene-2,7-disulfonic acid
• CAS: 2103-73-3
• 化学式: C₂₂H₁₄Cl₂N₄O₁₆S₄
• 分子量: 789.54
• InChiKey: XDNFKABIVXQRES-UHFFFAOYSA-N

物化性质

• 密度：
  2.14±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  48
• 可旋转键数：
  8
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  381
• 氢给体数：
  8
• 氢受体数：
  20

安全信息

• 安全说明：
  S22,S24/25
• WGK Germany：
  3

反应信息

• 作为反应物：
  描述：

  scandium(III) perchlorate 、 氯磺酚S 以 水 为溶剂， 生成
  参考文献：
  名称：

  Fadeeva, V. I.; Ivanov, V. M.; Eremeeva, N. V., Zhurnal Neorganicheskoi Khimii, 1968, vol. 13, p. 1524 - 1528

  摘要：

  DOI：

文献信息

• METHOD FOR TREATING SURFACE OF SUBSTRATE AND SURFACE TREATMENT COMPOSITION THEREFOR
  申请人：MITSUBISHI CHEMICAL CORPORATION

  公开号：EP0789071A1

  公开（公告）日：1997-08-13

  A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from the following Group A complexing agents and at least one member selected from the group consisting of the following Groups B1 to B6 complexing agents: Group A:complexing agents having an aromatic hydrocarbon ring in the molecular structure thereof and at least one of an OH group and/or an O- group bonded directly to a carbon atom constituting the ring; Group B1:complexing agents having at least one nitrogen atom as a donor atom in the molecular structure thereof; Group B2:complexing agents having at least one atom selected from halogen, sulfur and carbon atoms as a donor atom in the molecular structure thereof; Group B3:complexing agents having at least one oxygen atom as a donor atom in the molecular structure thereof, but not having a carbonyl group and a carboxyl group and not having any one of nitrogen, halogen, sulfur and carbon atoms as a donor atom; Group B4:carboxylic acid type complexing agents having at least one carboxyl group in the molecular structure thereof, but not having any one of nitrogen, halogen, sulfur and carbon atoms as a donor atom and not having a carbonyl group and a hydroxyl group; Group B5:hydroxymono- or di-carboxylic acid type complexing agents having at most 4 hydroxyl groups in the molecular structure thereof, but not having any one of nitrogen, halogen, sulfur and carbon atoms as a donor atom and not having a carbonyl group; and Group B6:complexing agents having at least one carbonyl group in the molecular structure thereof.

  一种用表面处理组合物处理基材表面的方法，其中表面处理组合物包括含有络合剂作为金属沉积防止剂的液体介质，络合剂包括至少一种选自以下A组络合剂的成员和至少一种选自以下B1至B6组络合剂组成的组的成员： A 组：络合剂，其分子结构中具有一个芳香烃环，且至少有一个 OH 基团和/或 O- 基团直接与构成该环的碳原子键合； B1组：络合剂，其分子结构中至少有一个氮原子作为供体原子； B2组：络合剂，其分子结构中至少有一个原子作为供体原子，该原子选自卤素、硫和碳原子； B3组:络合剂，其分子结构中至少有一个氧原子作为供体原子，但没有羰基和羧基，也没有氮、卤素、硫和碳原子中的任何一个原子作为供体原子； B4组：羧酸类络合剂，其分子结构中至少有一个羧基，但没有氮、卤素、硫和碳原子中的任何一个原子作为供体原子，也没有羰基和羟基； B5 组：分子结构中最多有 4 个羟基，但不以氮、卤素、硫和碳原子中的任一个作 为供体原子，且不含羰基的羟基单羧酸或二羧酸类络合剂；以及 B6 组：分子结构中至少有一个羰基的络合剂。
• Method for treating surface of substrate and surface treatment composition used for the same
  申请人：Mitsubishi Chemical Corporation

  公开号：US20020045556A1

  公开（公告）日：2002-04-18

  A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from Group A complexing agents and at least one member selected from Group B complexing agents as defined hereinafter.

  一种用表面处理组合物处理基底表面的方法，其中表面处理组合物包括含有络合剂作为金属沉积预防剂的液体介质，络合剂包括至少一种选自下文定义的 A 组络合剂和至少一种选自 B 组络合剂的成员。
• Gmelin Handbuch der Anorganischen Chemie, Gmelin Handbook: Sc: MVol.D2, 4.6, page 78 - 85
  作者：

  DOI：——

  日期：——
• SEMICONDUCTOR DEVICE AND ADHESIVE SHEET
  申请人：Hayashi Hidekazu

  公开号：US20110068480A1

  公开（公告）日：2011-03-24

  The present invention provides a semiconductor device which comprises a substrate, a first semiconductor chip on a substrate, a second semiconductor chip on the first semiconductor chip, and an adhesive sheet between the first and second semiconductor chips. The second semiconductor chip has a mirrored back surface, and the adhesive sheet contains a metal impurity ion trapping agent.
• US4361842A
  申请人：——

  公开号：US4361842A

  公开（公告）日：1982-11-30