申请人:TOKYO OHKA KOGYO CO., LTD.
公开号:US10696845B2
公开(公告)日:2020-06-30
An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.
一种能量敏感树脂组合物,使用该组合物,即使在低温下对前体聚合物进行热处理,也能生产出一种薄膜或模塑制品,该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成,或由具有优异耐热性、拉伸伸长率和耐化学性的含噁唑环聚合物组成。制造薄膜或模塑制品的方法;使用能量敏感树脂组合物形成图案的方法;以及具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括咪唑化合物、树脂前体组分和溶剂,树脂前体组分是单体组分中的至少一种,包括二胺化合物、二羰基化合物和/或四羧酸二酐;以及具有重复单元的前体聚合物。