Bis-<4-tert.-butyl-phenyl>-sulfon | 5453-70-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: Bis-<4-tert.-butyl-phenyl>-sulfon
• 英文别名: 4,4'-Ditert.-butyldiphenyl-sulphon；Bis-(4-t-Butyl-phenyl)-sulfon；1,1'-Sulfonylbis(4-tert-butylbenzene)；1-tert-butyl-4-(4-tert-butylphenyl)sulfonylbenzene
• CAS: 5453-70-3
• 化学式: C₂₀H₂₆O₂S
• 分子量: 330.491
• InChiKey: DQGFHAXHQIHSOQ-UHFFFAOYSA-N

物化性质

• 熔点：
  213-215 °C
• 沸点：
  442.2±34.0 °C(Predicted)
• 密度：
  1.062±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6.1
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  42.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  Bis-<4-tert.-butyl-phenyl>-sulfon 在 氯磺酸 作用下， 以 四氯乙烯 为溶剂， 生成 对叔丁基苯磺酰氯
  参考文献：
  名称：

  Sulfonation of negatively substituted tert-butylbenzene derivatives

  摘要：

  DOI：

  10.1021/jo00828a080
• 作为产物：
  描述：

  叔丁基苯 在 PPA 、 磷酸 、 硫酸 作用下， 生成 Bis-<4-tert.-butyl-phenyl>-sulfon
  参考文献：
  名称：

  Mody,M.K. et al., Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1977, vol. 15B, p. 1008 - 1012

  摘要：

  DOI：

文献信息

• Redox-Neutral Organometallic Elementary Steps at Bismuth: Catalytic Synthesis of Aryl Sulfonyl Fluorides
  作者：Marc Magre、Josep Cornella

  DOI：10.1021/jacs.1c11463

  日期：2021.12.29

  A Bi-catalyzed synthesis of sulfonyl fluorides from the corresponding (hetero)aryl boronic acids is presented. We demonstrate that the organobismuth(III) catalysts bearing a bis-aryl sulfone ligand backbone revolve through different canonical organometallic steps within the catalytic cycle without modifying the oxidation state. All steps have been validated, including the catalytic insertion of SO2

  介绍了由相应的（杂）芳基硼酸双催化合成磺酰氟。我们证明了带有双芳基砜配体骨架的有机铋（III）催化剂在催化循环中通过不同的规范有机金属步骤旋转，而不会改变氧化态。所有步骤都已经过验证，包括将 SO 2催化插入Bi-C 键，从而形成结构独特的 O 键亚磺酸铋复合物。该催化方案为各种芳基和杂芳基硼酸提供了出色的收率，显示出广泛的官能团耐受性。
• [EN] [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS<br/>[FR] COMPOSÉS À TERMINAISON [(2-ÉTHOXY-5-TRANS-1-PROPÉN-1-YL)-PHÉNOXYLE]
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045931A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：（I）其中D是一个x官能团；x是大于等于2的整数；但需注意x官能团D不是具有平均摩尔质量在15000克/摩尔至150000克/摩尔范围内的聚碳酸酯。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可以在结构胶、纤维预浸料的基体树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] THERMOSETTING RESIN COMPOSITIONS<br/>[FR] COMPOSITIONS DE RÉSINE THERMODURCISSABLE
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2017108946A1

  公开（公告）日：2017-06-29

  Meta and para alkenyl phenols are reacted with hydroxyl benzophenone to produce compounds of the genera formula or which are used as curatives for polymaleimide resins.

  甲基和对烯基酚与羟基苯甲酮反应，产生通式化合物，用作聚马来酰亚胺树脂的固化剂。
• [EN] ALKENYLPHENOXY-SUBSTITUTED 1,1-DIPHENYLETHYLENES, PROCESSES FOR THEIR PREPARATION, AND THEIR USE<br/>[FR] 1,1-DIPHÉNYLÉTHYLÈNES SUBSTITUÉS PAR UN ALCÉNYLPHÉNOXY, LEURS PROCÉDÉS DE PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045932A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及根据式(I)的化合物以及基于聚马来酰亚胺树脂体系的热固性组合物，其中这些化合物作为共聚单体：其中R1是氢或烯基苯氧基，R2是烯基苯氧基，R3是氢或具有1至4个碳原子的烷基基团。本发明还涉及通过固化这种组合物获得的交联树脂。本发明的化合物可以在结构粘合剂、纤维预浸料的基质树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] ASYMMETRICALLY SUBSTITUTED BIS-ALKENYL DIPHENYL ETHERS, THEIR PREPARATION AND USE<br/>[FR] ÉTHERS DE BIS-ALCÉNYLE DIPHÉNYLE SUBSTITUÉS DE MANIÈRE ASYMÉTRIQUE, LEUR PRÉPARATION ET LEUR UTILISATION
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2018091253A1

  公开（公告）日：2018-05-24

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 signifies an 1-alkenyl- or 2-alkenyl group with 3 to 6 carbon atoms, wherein R2 signifies hydrogen or an alkoxy group with up to 2 carbon atoms, wherein R3 signifies hydrogen or an alkyl group with up to 4 carbon atoms, and wherein R4 signifies hydrogen or an alkyl group with up to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：其中R1表示具有3到6个碳原子的1-烯基或2-烯基基团，R2表示氢或具有最多2个碳原子的烷氧基团，R3表示氢或具有最多4个碳原子的烷基团，R4表示氢或具有最多4个碳原子的烷基团。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可用于结构胶粘剂、纤维预浸料基体树脂、成型复合材料以及结构和/或电气复合材料等领域。