1-t-butylperoxy-2-methylcyclohexane | 136773-27-8

• 分子结构分类: 有机化合物 - 有机氧化合物 - 有机氧化物
• 英文名称: 1-t-butylperoxy-2-methylcyclohexane
• 英文别名: 1-Tert-butylperoxy-2-methylcyclohexane
• CAS: 136773-27-8；136773-28-9
• 化学式: C₁₁H₂₂O₂
• 分子量: 186.294
• InChiKey: PEHHIFQTECNPHG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  13
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  叔丁基过氧化氢 、 双环[4.1.0]庚烷 生成 1-t-butylperoxy-2-methylcyclohexane
  参考文献：
  名称：

  Bloodworth, A. J.; Chan, Kam Hung; Cooksey, Christopher J., Journal of the Chemical Society. Perkin transactions I, 1991, # 8, p. 1923 - 1930

  摘要：

  DOI：

文献信息

• RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIALS, MOLDINGS OF FIBER-REINFORCED RESIN, AND PROCESS FOR PRODUCTION THEREOF
  申请人：DIC Corporation

  公开号：EP2468793A1

  公开（公告）日：2012-06-27

  The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

  本发明提供了一种用于纤维增强复合材料的树脂组合物，该组合物具有优异的流动性和对纤维基材的浸渍性，并能生产出具有优异耐热性的固化产品。一种用于纤维增强复合材料的树脂组合物含有以下基本成分：聚缩水甘油醚化合物 （A）、可聚合单体（B），后者是一种不饱和羧酸或其酸酐，分子量在 160 或 160 以下、芳香族乙烯基化合物或(甲基)丙烯酸酯(C)，以及自由基聚合引发剂(D)，其中组分(A)中的缩水甘油氧基与组分(B)中的酸基的当量比[缩水甘油氧基/酸基]为 1/1 至 1/0.48，组分(B)与组分(C)的摩尔比[(B)/(C)]在 1/0.55 至 1/2 之间。
• HEAT-CURABLE RESIN COMPOSITION
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3135722A1

  公开（公告）日：2017-03-01

  Provided is a heat-curable resin composition for use in electric and electronics industry which is suitable as an underfill and for performing potting, and is superior in fluidity, moisture resistance reliability and adhesiveness at a high temperature. The heat-curable resin composition of the invention contains (A) a heat-curable resin; and (B) a bismaleimide compound in liquid form at 25°C, and exhibits a viscosity of 1 mPa·s to 850 Pa·s when measured at 25°C in accordance with a method described in JIS Z8803:2011.

  本发明提供了一种用于电气和电子工业的热固化树脂组合物，该组合物适合用作底部填充物和进行灌封，并且在流动性、防潮可靠性和高温下的粘合性方面都非常出色。本发明的热固化树脂组合物包含 (A) 热固化树脂；和 (B) 双马来酰亚胺化合物，25°C 时为液态，25°C 时按照 JIS Z8803:2011 中描述的方法测量，粘度为 1 mPa-s 至 850 Pa-s。
• RESIN COMPOSITION, RESIN COMPOSITION FOR TRANSPARENT AUTOMOBILE MEMBERS, TRANSPARENT COVER FOR METER PANEL, AND HEMISPHERICAL LENS
  申请人：Denka Company Limited

  公开号：EP3296357A1

  公开（公告）日：2018-03-21

  A resin composition capable of producing a molded article excellent in transparency, heat resistance, surface hardness, impact resistance and hue is provided. According to the present invention, there is provided a resin composition comprising 15 to 100 mass% of a styrene-based copolymer (A) and 0 to 85 mass% of a methacrylic resin(B), wherein the styrene-based copolymer (A) comprises 45 to 85 mass% of an aromatic vinyl monomer unit, 5 to 45 mass% of a (meth)acrylic ester monomer unit, and 10 to 30 mass% of an unsaturated dicarboxylic anhydride monomer unit, and has a weight average molecular weight(Mw) of 100,000 to 300,000, and a total light transmittance of 89 % or more for a thickness of 2 mm.

  本发明提供了一种树脂组合物，该树脂组合物能够生产出透明度、耐热性、表面硬度、抗冲击性和色调均优异的成型品。根据本发明，提供了一种树脂组合物，它包含 15 至 100 质量％的苯乙烯基共聚物 (A) 和 0 至 85 质量％的甲基丙烯酸树脂 (B)，其中苯乙烯基共聚物 (A) 包含 45 至 85 质量％的芳香族乙烯基单体单元、5 至 45 质量%的（甲基）丙烯酸酯单体单元和 10 至 30 质量%的不饱和二羧酸酐单体单元，其重量平均分子量（Mw）为 100,000 至 300,000，厚度为 2 毫米时的总透光率为 89 % 或以上。
• LIQUID EPOXY RESIN COMPOSITION
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3354674A1

  公开（公告）日：2018-08-01

  Provided is a liquid epoxy resin composition that is superior in workability and adhesion to a base material, and exhibits an unimpaired resin reliability even under a high-temperature and high-humidity environment. The liquid epoxy resin composition contains (A) an epoxy resin; (B) an imidazole-based curing accelerator; and (C) a maleimide compound. The weight-average molecular weight (Mw) of the maleimide compound (C) is 500 to 2,000, and a maleimide group equivalent per 1 mol of the maleimide compound (C) is 250 to 1,000 g/eq.

  本发明提供了一种液态环氧树脂组合物，该组合物具有优异的可加工性和与基材的粘合性，即使在高温高湿环境下也不会降低树脂的可靠性。液态环氧树脂组合物包含：（A）环氧树脂；（B）咪唑类固化促进剂；（C）马来酰亚胺化合物。马来酰亚胺化合物（C）的重量平均分子量（Mw）为 500 至 2 000，每 1 摩尔马来酰亚胺化合物（C）的马来酰亚胺基当量为 250 至 1 000 克/当量。
• Primer for solar cell module and solar cell module
  申请人：KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

  公开号：US10483418B2

  公开（公告）日：2019-11-19

  Provided is a primer for a solar cell module which makes it possible to prevent peeling of a surface protective material from a sealing material over a long time, and a solar cell module manufactured using this primer. The primer includes 40 to 95 parts by mass of a polymerizable ester, 5 to 60 parts by mass of an adhesion promoter, and a polymerization initiator. The polymerizable ester includes at least one of an acryloyl group and a methacryloyl group. The adhesion promoter includes a functional group improvable is adhesion to an acrylic resin or a methacrylic resin, and an alkoxysilyl group. The polymerization initiator is configured to be able to initiate polymerization of the polymerizable ester. The content of the polymerization initiator is 0.1 to 10 parts by mass based on 100 parts by mass as a total of the polymerizable ester and the adhesion promoter.

  本发明提供了一种用于太阳能电池组件的底漆，该底漆可长时间防止表面保护材料从密封材料上剥落，还提供了一种使用该底漆制造的太阳能电池组件。该底漆包括 40 至 95 份（按重量计）可聚合酯、5 至 60 份（按重量计）附着力促进剂和聚合引发剂。可聚合酯包括丙烯酰基和甲基丙烯酰基中的至少一种。附着力促进剂包括一个可改善与丙烯酸树脂或甲基丙烯酸树脂附着力的官能团和一个烷氧基硅烷基。聚合引发剂用于引发可聚合酯的聚合。聚合引发剂的含量为 0.1 至 10 质量份（以可聚合酯和附着力促进剂的总质量为 100 质量份计）。