PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
申请人:JEONG Chul Ho
公开号:US20120135251A1
公开(公告)日:2012-05-31
A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.
US5472823A
申请人:——
公开号:US5472823A
公开(公告)日:1995-12-05
US5668248A
申请人:——
公开号:US5668248A
公开(公告)日:1997-09-16
US6307008B1
申请人:——
公开号:US6307008B1
公开(公告)日:2001-10-23
Goek, Yasar; Bilgin, Ahmet; Ertepinart, Hamide, Indian Journal of Chemistry, Section A: Inorganic, Physical, Theoretical and Analytical, 2000, vol. 39, # 12, p. 1280 - 1285