CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX
申请人:Zenfuku Kazutaka
公开号:US20090042762A1
公开(公告)日:2009-02-12
The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains:
(A) a polyoxyalkylene phosphate-based surfactant,
(B) a metal chelating agent, and
(C) a halogen-free organic solvent;
and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by
M
a
H
b
(CO
3
)
C
General Formula (7)
where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.