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2-[2-[(1-乙基戊基)氧基]乙氧基]乙醇 | 10138-87-1

中文名称
2-[2-[(1-乙基戊基)氧基]乙氧基]乙醇
中文别名
——
英文名称
2-(2-(3-Heptyloxy)ethoxy)ethanol
英文别名
2-(2-heptan-3-yloxyethoxy)ethanol
2-[2-[(1-乙基戊基)氧基]乙氧基]乙醇化学式
CAS
10138-87-1
化学式
C11H24O3
mdl
——
分子量
204.31
InChiKey
KBAWNJHIFOTMPH-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    277.81°C (rough estimate)
  • 密度:
    0.9109 (estimate)

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    14
  • 可旋转键数:
    10
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    38.7
  • 氢给体数:
    1
  • 氢受体数:
    3

文献信息

  • Low pollution fuel
    申请人:Hamada, Yoshiro
    公开号:EP1178101A2
    公开(公告)日:2002-02-06
    To provide a low pollution fuel which is capable of fundamentally solving the problem of exhaust gas discharged from trucks, etc. which use light oil, etc. as their fuel, without depending on the conventional symptomatic measures. The low pollution fuel is obtained by blending an ethylene glycol based compound having a CH2CH2 group in a molecule formula with a liquid hydrocarbon.
    提供一种低污染燃料,它能够从根本上解决以轻油等为燃料的卡车等排放废气的问题,而无需依赖传统的对症措施。这种低污染燃料是通过将分子式中含有 CH2CH2 基团的乙二醇基化合物与液态烃混合而获得的。
  • CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX
    申请人:Zenfuku Kazutaka
    公开号:US20090042762A1
    公开(公告)日:2009-02-12
    The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains: (A) a polyoxyalkylene phosphate-based surfactant, (B) a metal chelating agent, and (C) a halogen-free organic solvent; and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by M a H b (CO 3 ) C General Formula (7) where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.
  • CLEANER COMPOSITION FOR REMOVING LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVING LEAD-FREE SOLDERING FLUX
    申请人:Tanaka Takashi
    公开号:US20100180917A1
    公开(公告)日:2010-07-22
    The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.
  • US8372792B2
    申请人:——
    公开号:US8372792B2
    公开(公告)日:2013-02-12
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