申请人:Shin-Etsu Chemical Co., Ltd.
公开号:EP1921114A1
公开(公告)日:2008-05-14
The present invention provides a heat-curable silicone resin composition that yields a cured product with excellent transparency and minimal discoloration over time, which is ideal as a protective material or lens material or the like for a light emitting diode element.
The present invention provides a heat-curable silicone composition, comprising:
(A) an organopolysiloxane having at least one structure represented by a general formula shown below within each molecule:
(wherein, m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, phenyl group or halogenated phenyl group, R2 represents a hydrogen atom or methyl group, R3 represents a monovalent organic group of 1 to 10 carbon atoms, Z1 represents a bivalent group represented by -R4-, -R4O- or -R4(CH3)2SiO- (wherein, R4 represents a bivalent organic group of 1 to 10 carbon atoms), and Z2 represents an oxygen atom or a bivalent organic group of 1 to 10 carbon atoms), and
(B) a quantity of an organic peroxide that is effective as a curing catalyst.
本发明提供了一种热固化硅树脂组合物,其固化产品具有极佳的透明度,且随着时间的推移褪色极少,是发光二极管元件的理想保护材料或透镜材料等。
本发明提供了一种热固化硅树脂组合物,包括
(A) 有机聚硅氧烷,其每个分子中至少有一个结构由下图所示通式表示:
(其中,m 代表 0、1 或 2 的整数,R1 代表氢原子、苯基或卤代苯基,R2 代表氢原子或甲基,R3 代表 1 至 10 个碳原子的一价有机基团、Z1代表由-R4-、-R4O-或-R4(CH3)2SiO-代表的二价基团(其中,R4代表1至10个碳原子的二价有机基团),Z2代表氧原子或1至10个碳原子的二价有机基团),和
(B) 一定量的可作为固化催化剂的有机过氧化物。