ethylendithiodipropyl-sulphonic acid | 674293-45-9

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机磺酸及其衍生物
• 英文名称: ethylendithiodipropyl-sulphonic acid
• 英文别名: ethylenedithiodipropylsulfonic acid；ethylendithiodipropylsulfonic acid；3,6-dithiaoctane-1,8-dimesylate；3,3'-(Ethane-1,2-diyldisulfanediyl)di(propane-1-sulfonic acid)；3-[2-(3-sulfopropylsulfanyl)ethylsulfanyl]propane-1-sulfonic acid
• CAS: 674293-45-9
• 化学式: C₈H₁₈O₆S₄
• 分子量: 338.491
• InChiKey: UZRYZOUNEIPKQQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0
• 重原子数：
  18
• 可旋转键数：
  11
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  176
• 氢给体数：
  2
• 氢受体数：
  8

反应信息

• 作为产物：
  描述：

  3-溴丙烷磺酸钠 、 sodium methylate 、 1,2-乙二硫醇 、 盐酸 在 乙醇 作用下， 以 乙醇 、 水 为溶剂， 反应 17.0h， 以giving 11.9 g (67.4%) as a white powder的产率得到ethylendithiodipropyl-sulphonic acid
  参考文献：
  名称：

  PLATING BATH AND METHOD

  摘要：

  本文披露了含有某些硫化物化合物的银电镀浴及使用这些浴液电沉积含银层的方法。这种电镀浴液可用于提供具有减少空洞形成和改善芯片内均匀性的含银焊料沉积物。

  公开号：

  US20130256145A1

文献信息

• PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL ALLOY PLATING BATHS CONTAINING SAID PYRIDINIUM COMPOUNDS AND A METHOD FOR USE OF SAID METAL OR METAL ALLOY PLATING BATHS
  申请人：Atotech Deutschland GmbH

  公开号：US20200231565A1

  公开（公告）日：2020-07-23

  The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths. The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.

  本发明涉及吡啶化合物、其制备的合成方法、含有所述吡啶化合物的金属或金属合金电镀浴以及使用所述金属或金属合金电镀浴的方法。这些电镀浴特别适用于填充电子和半导体行业中的凹陷结构，包括双重达曼赛应用。
• Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
  申请人：Atotech Deutschland GmbH

  公开号：US11066553B2

  公开（公告）日：2021-07-20

  The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.

  本发明涉及咪唑基脲聚合物及其在水性酸性电镀浴中的应用，用于金属或金属合金沉积，例如在制造印刷电路板、集成电路基板、半导体和电子应用玻璃器件中的铜或其合金的电解沉积。根据本发明的电镀浴包括至少一种金属离子来源和一种咪唑基脲聚合物。该电镀浴特别适用于填充凹陷结构和构建柱形凸起结构。
• PLATING BATH AND METHOD
  申请人：Romer Duane R.

  公开号：US20130256145A1

  公开（公告）日：2013-10-03

  Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.

  本文披露了含有某些硫化物化合物的银电镀浴及使用这些浴液电沉积含银层的方法。这种电镀浴液可用于提供具有减少空洞形成和改善芯片内均匀性的含银焊料沉积物。
• IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATING BATH COMPOSITIONS
  申请人：Atotech Deutschland GmbH

  公开号：EP3135709A1

  公开（公告）日：2017-03-01

  The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.

  本发明涉及咪唑酰基脲聚合物及其在水性酸性电镀液中的用途，该电镀液用于沉积金属或金属合金，例如在制造印刷电路板、集成电路基板、电子应用中的半导体和玻璃设备时电解沉积铜或其合金。根据本发明的电镀液包括至少一种金属离子源和咪唑酰脲聚合物。该电镀液特别适用于填充凹陷结构和柱状凸起结构。
• AN ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
  申请人：Atotech Deutschland GmbH

  公开号：EP3470552A1

  公开（公告）日：2019-04-17

  The present invention relates to an acidic aqueous composition for electrolytically depositing a copper deposit, the composition comprising (i) copper (II) ions, (ii) one or more than one compound of formula (la) (iii) one, two, three or more than three further compounds, which are different from the compound of formula (la), with the definitions given throughout the text, the use of the acidic aqueous composition for electrolytically depositing a copper deposit, the use of the compound of formula (la) as surfactant in preferably an acidic aqueous composition, a method for electrolytically depositing a copper deposit onto a substrate, and a compound of formula (la), preferably a specific compound derived from formula (la).

  本发明涉及一种用于电解沉积铜沉积物的酸性含水组合物，该组合物包括 (i) 铜 (II) 离子、 (ii) 一种或多种式(la)化合物 (iii) 一种、两种、三种或三种以上不同于式（la）化合物的其他化合物、 使用酸性水性组合物电解沉积铜沉积物，在优选的酸性水性组合物中使用式（la）化合物作为表面活性剂，将铜沉积物电解沉积到基底上的方法，以及式（la）化合物，优选由式（la）衍生的特定化合物。