申请人:Enthone Inc.
公开号:EP2657367A1
公开(公告)日:2013-10-30
The present invention relates to a pre-etching composition for the treatment of non-conductive substrates in a plating process for the deposition of a metal layer on the substrate surface. More specifically, the invention relates to an aqueous pre-etching composition for a plastic substrate, like e.g. an acrylonitrile butadiene styrene (ABS), a polycarbonate (PC), polyetherimide (PEI), or a blend of an acrylonitrile butadiene styrene (ABS) and a polycarbonate (PC). An aqueous pre-etching composition for the treatment of non-conductive substrates in a plating process for the deposition of a metal layer on a substrate surface is provided, wherein the pre-etching composition contains at least one water soluble solvent and which is characterized in that the composition contains at least one compound selected from the group consisting of terpenes and phenylpropanoides.
本发明涉及一种预蚀组合物,用于在电镀工艺中处理非导电基材,以便在基材表面沉积金属层。更具体地说,本发明涉及一种用于塑料基底的水性预蚀组合物,例如丙烯腈-丁二烯-苯乙烯(ABS)、聚碳酸酯(PC)、聚醚酰亚胺(PEI)或丙烯腈-丁二烯-苯乙烯(ABS)和聚碳酸酯(PC)的混合物。本发明提供了一种水性预蚀组合物,用于在电镀工艺中处理非导电基底,以便在基底表面沉积金属层,其中预蚀组合物含有至少一种水溶性溶剂,其特征在于该组合物含有至少一种选自萜类和苯丙酸类的化合物。