An electronic device substrate includes a substrate having at least one of a metal and a metal oxide on a surface thereof and an underlying layer having a compound expressed by a following general formula (1):
wherein X presents one of a hydrogen atom and a protecting group; Y1 represents one of an oxygen atom, an alkylene group and -N(R1)-, in which R1 represents an alkyl group. Z1 represents a polymerization initiating group; n1 represents an integer from 1 to 4; and m1 represents an integer from 1 to 15.
一种电子设备基板包括在其表面具有
金属和金属氧化物中至少一种的基板,以及具有由以下通式(1)表示的化合物的底层:
其中 X 代表氢原子和保护基团中的一种;Y1 代表氧原子、亚烷基和-N(R1)-中的一种,其中 R1 代表烷基。Z1 代表聚合引发基;n1 代表 1 至 4 的整数;m1 代表 1 至 15 的整数。