The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
本发明提供了一种用于去除助焊剂的清洗剂和清洗助焊剂的方法,即使在清洗无
铅助焊剂、高熔点助焊剂或类似物质时也能表现出优异的清洗性能,同时在下一步使用
酒精溶剂进行漂洗时表现出优异的漂洗性能。因此,本发明提供了一种用于去除焊剂的清洗剂,它将
苯甲醇的含量设定在 70 至 99.9 重量%的范围内,将
氨基醇的含量设定在 0.当
乙二醇化合物的含量相对于去除焊剂的清洁剂总量低于 1 重量%时,将
苯甲醇的含量设定为 15 至 99 重量%范围内的值,当
乙二醇化合物的含量相对于去除焊剂的清洁剂总量在 1 至 40 重量%范围内时,将
氨基醇的含量设定为 0.1 至 30 重量%范围内的值。去除助焊剂的清洗剂用于清洗无
铅助焊剂和高熔点助焊剂等。