Hepta-4,5-dien-2-one | 4187-75-1

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: Hepta-4,5-dien-2-one
• 英文别名: 4,5-Heptadien-2-one
• CAS: 4187-75-1
• 化学式: C₇H₁₀O
• 分子量: 110.156
• InChiKey: AAOZVMCWCVICGM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  8
• 可旋转键数：
  2
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  17.1
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE
  申请人：LG Chem, Ltd.

  公开号：EP2270112B1

  公开（公告）日：2014-08-13
• EPOXY-BASED COMPOSITION, ASHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE
  申请人：LG CHEM, LTD.

  公开号：US20130281571A1

  公开（公告）日：2013-10-24

  Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.
• US9659763B2
  申请人：——

  公开号：US9659763B2

  公开（公告）日：2017-05-23
• US9793103B2
  申请人：——

  公开号：US9793103B2

  公开（公告）日：2017-10-17