1,1'-[(1-Methyl-1,2-ethanediyl)bis(oxy)]bis[2-propanamine] | 22501-88-8

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 1,1'-[(1-Methyl-1,2-ethanediyl)bis(oxy)]bis[2-propanamine]
• 英文别名: 1-[2-(2-aminopropoxy)propoxy]propan-2-amine
• CAS: 22501-88-8
• 化学式: C₉H₂₂N₂O₂
• 分子量: 190.28
• InChiKey: ZIFLDIAMYNDDKS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.7
• 重原子数：
  13
• 可旋转键数：
  7
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• PROCESS FOR THE PRODUCTION OF ETHER ISOCYANATES BACKGROUND OF THE INVENTION
  申请人：——

  公开号：US20020045723A1

  公开（公告）日：2002-04-18

  Ether isocyanates are prepared by phosgenation of ether amines in the vapor phase.

  乙醚异氰酸酯是通过气相中的乙醚胺经过光气化反应制备的。
• POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20150212412A1

  公开（公告）日：2015-07-30

  The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

  本发明提供了一种正型光敏树脂组合物，能够获得低翘曲性的固化膜，并且在低于250℃的较低温度下烧结时具有高灵敏度和高分辨率。本发明揭示了一种正型光敏树脂组合物，包括（a）聚酰亚胺树脂，包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，以及（b）喹喔啉二酮化合物。其中，聚酰亚胺树脂包括由一般式（1）表示的结构单元和由一般式（2）表示的结构单元，其酰亚胺化比例为85％或更高，并且一般式（1）表示的结构单元与一般式（2）表示的结构单元的比例在30:70至90:10的范围内，其中，一般式（1）中的X1表示包括1至4个芳香环的四羧酸残基，Y1表示包括1至4个芳香环的芳香二胺残基，一般式（2）中的X2表示包括1至4个芳香环的四羧酸残基，Y2表示主链中包含至少两个或更多的烷基二醇单元的二胺残基。
• POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE CONTAINING A CURED FILM USING SAID COMPOSITION
  申请人：Toray Industries, Inc.

  公开号：EP2902847A1

  公开（公告）日：2015-08-05

  The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250°C or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y2 represents a diamine residue including at least two or more alkylene glycol units in the main chain.

  本发明提供了一种正型感光树脂组合物，该组合物能够获得低翘曲的固化膜，并且在 250°C 或更低温度下烧制时具有优异的高灵敏度和高分辨率。本发明公开了一种正型感光树脂组合物，包括 (a) 聚酰亚胺树脂（包括通式 (1) 所代表的结构单元和通式 (2) 所代表的结构单元）和 (b) 喹螨酯化合物、其中，包括通式(1)代表的结构单元和通式(2)代表的结构单元的聚酰亚胺树脂的亚胺化率为85%或以上，通式(1)代表的结构单元与通式(2)代表的结构单元的比例范围为30：通式（1）中的 X1 代表包括 1 至 4 个芳香环的四羧酸残基，Y1 代表包括 1 至 4 个芳香环的芳香二胺残基，通式（2）中的 X2 代表包括 1 至 4 个芳香环的四羧酸残基，Y2 代表主链中至少包括两个或更多亚烷基二醇单元的二胺残基。
• RESIN, COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3339352A1

  公开（公告）日：2018-06-27

  Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.

  本发明提供了一种能够生成翘曲较少且均匀性良好的固化膜以及生成浮渣较少的固化膜（图案）的树脂；一种使用该树脂的组合物；一种固化膜；以及一种制造固化膜和半导体器件的方法。该树脂选自聚酰亚胺前体、聚酰亚胺、聚苯并恶唑前体和聚苯并恶唑，具有可聚合基团，分子量为 1,000 或更小的成分的总含量为 0.005 至 1.0%（质量百分比）。
• PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3633455A1

  公开（公告）日：2020-04-08

  Provided are a photosensitive resin composition which has high breaking elongation and high excellent storage stability in case of forming a cured film, a polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device to solve the problems. A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

  本发明提供了一种在形成固化膜的情况下具有高断裂伸长率和高优异储存稳定性的光敏树脂组合物、一种聚合物前体、一种固化膜、一种层压板、一种固化膜的生产方法以及一种解决上述问题的半导体设备。本发明还提供了一种光敏树脂组合物，它包括选自聚酰亚胺前体和聚苯并恶唑前体的聚合物前体；光辐射聚合引发剂；以及溶剂，其中聚合物前体所含酸性基团的酸值在 pH 值为 7.0至12.0范围内的酸值为2.5至34.0 mgKOH/g，聚合物前体含有可辐射聚合的基团，或者感光树脂组合物包括聚合物前体以外的可辐射聚合的化合物。