The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.
本发明是一种负感光
树脂组合物,包括:(A)一种碱溶性
树脂,其中至少含有一种或多种结构,这些结构选自聚
酰亚胺结构、聚
苯并恶唑结构、聚酰胺-
酰亚胺结构及其前体结构;(B)一种可交联聚合物化合物,其中含有由下式(1)表示的结构单元,并具有与组分(A)交联的基团;(C)一种在光照下生成酸的化合物;以及(D)一种热
交联剂。本发明的目的是提供一种负感光
树脂组合物,它能形成具有高矩形度和高分辨率的精细图案,即使在低温下固化也具有优异的机械特性,而且在高温高湿试验前后粘合力不会下降。