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3,3'-Dihydroxy-dicyclohexyl (rac.-aequatorial-axial) | 102282-13-3

中文名称
——
中文别名
——
英文名称
3,3'-Dihydroxy-dicyclohexyl (rac.-aequatorial-axial)
英文别名
3,3'-Dihydroxy-dicyclohexyl (meso-axial-axial);3-(3-Hydroxycyclohexyl)cyclohexan-1-ol
3,3'-Dihydroxy-dicyclohexyl (rac.-aequatorial-axial)化学式
CAS
102282-13-3
化学式
C12H22O2
mdl
——
分子量
198.305
InChiKey
DBPGNYDMZZTCTQ-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2.3
  • 重原子数:
    14
  • 可旋转键数:
    1
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    40.5
  • 氢给体数:
    2
  • 氢受体数:
    2

文献信息

  • [EN] PREPARATION OF ALICYCLIC DIEPOXIDES<br/>[FR] PRÉPARATION DE DIÉPOXYDES ALICYCLIQUES
    申请人:PROMERUS LLC
    公开号:WO2010042939A1
    公开(公告)日:2010-04-15
    Embodiments in accordance with the present invention provide alicyclic diepoxide compounds and methods for forming such compounds. Such methods encompass charging a reaction vessel with an appropriate diene and an appropriate dienophile and causing such to react to form and recover a desired alicyclic diepoxide precursor where such precursor is subsequently epoxidized. Such compounds encompass alicyclic diepoxides having purities of at least 95 percent or at least 98 percent with respect non-isomeric residues and are essentially free of any isomeric alicyclic diepoxide residues.
    根据本发明的实施例提供了脂环双环氧化合物及形成这种化合物的方法。这些方法包括向反应容器中加入适当的二烯和适当的二烯亲电体,并使其发生反应以形成和回收所需的脂环双环氧化物前体,随后对该前体进行环氧化。这些化合物包括至少95%或至少98%纯度的脂环双环氧化物,其非异构残留物占比,并且基本上不含任何异构的脂环双环氧化物残留物。
  • Curable epoxy resin composition
    申请人:ASAHI DENKA KOGYO KABUSHIKI KAISHA
    公开号:EP0197458A2
    公开(公告)日:1986-10-15
    A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic , resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.
    本发明提供了一种单组分热固性环氧树脂组合物,其不可或缺的成分包括:(I) 分子中平均含有一个以上相邻环氧基团的环氧树脂;(II) 固化量或固化加速量的化合物,该化合物由(a)特定的胺/环氧加合物与(b)树脂和/或多羟基化合物反应而得,(a)与(b)的重量比为 1/0.1 至 1/0.8。本发明的组合物具有极佳的储存稳定性,可在相对较低的温度下固化,形成具有极佳机械强度、粘合性和耐性的固化产品。
  • THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
    申请人:FUJIFILM Corporation
    公开号:EP3162868A1
    公开(公告)日:2017-05-03
    Provided are a thermal base generator which is capable of performing cyclization of a thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40°C or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.
    本发明提供了一种热碱发生器,它能够在低温下对热固性树脂进行环化,并用它制备出稳定性极佳的热固性树脂组合物、热固性树脂组合物、固化膜、固化膜制造方法和半导体设备。 热碱发生器包括至少一种酸性化合物和盐,前者在加热到 40°C 或更高温度时产生碱,后者含有 pKa1 为 0 至 4 的阴离子和阳离子。酸性化合物最好是盐和/或下式(1)所代表的化合物,其中 A1 代表 p 价有机基团,R1 代表一价有机基团,L1 代表 (m+1)- 价有机基团,m 代表 1 或 1 以上的整数,p 代表 1 或 1 以上的整数。
  • COMPOSITION FOR SYNTHESIZING LIQUID CRYSTAL POLYMER, LIQUID CRYSTAL POLYMER FOR ELECTRIC AND ELECTRONIC PRODUCTS USING SAME, POLYMER RESIN COMPOSITION USING SAME, AND MOLDED PRODUCT USING SAME
    申请人:SK Chemicals Co., Ltd.
    公开号:EP3636727A1
    公开(公告)日:2020-04-15
    The present invention relates to a composition for liquid crystal polymer synthesis having excellent insulation properties, heat resistance, and processability, a liquid crystal polymer for electrical/electronic products, a polymer resin composition, and a molded product using the same.
    本发明涉及一种具有优异绝缘性、耐热性和加工性的液晶聚合物合成用组合物、一种电气/电子产品用液晶聚合物、一种聚合物树脂组合物以及一种使用该组合物的模塑产品。
  • Use of organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
    申请人:Dow Global Technologies LLC
    公开号:EP1837902B1
    公开(公告)日:2017-05-24
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