A positive type or negative type photoresist composition for fine processing having excellent resolution, sensitivity, adhesive-ness and developability comprising:
(a) an alkali soluble resin or a resin having anti-alkali dissolution groups in the molecules thereof,
(b) a light-sensitive compound, and
(c) at least one organic compound selected from the group consisting of organic phosphorus acid compounds and esters thereof in an amount of 0.001 to 10% by weight based on a weight of the resin. In addtion, the present invention is directed to an etching method utilizing the positive type or negative type photoresist composition.
一种用于精细加工的正型或负型光刻胶组合物,具有优异的分辨率、灵敏度、粘合性和显影性,包括
(a) 碱溶性
树脂或在其分子中含有抗碱溶解基团的
树脂、
(b) 一种光敏化合物,和
(c) 至少一种选自有机
磷酸化合物及其
酯类的有机化合物,其含量为
树脂重量的 0.001 至 10%。此外,本发明还涉及一种利用正型或负型光刻胶组合物的蚀刻方法。