4-methoxy-N-tert-octylaniline | 1334232-81-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 4-methoxy-N-tert-octylaniline
• 英文别名: 4-methoxy-N-(2,4,4-trimethylpentan-2-yl)aniline；4-methoxy-N-(2,4,4-trimethyl pentan-2-yl)aniline
• CAS: 1334232-81-3
• 化学式: C₁₅H₂₅NO
• 分子量: 235.37
• InChiKey: JOFXLHOWPPAMKB-UHFFFAOYSA-N

物化性质

• 沸点：
  329.1±25.0 °C(Predicted)
• 密度：
  0.947±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.6
• 重原子数：
  17
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.6
• 拓扑面积：
  21.3
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  叔辛胺 在 titanium(IV) isopropylate 、 N-氯代丁二酰亚胺 作用下， 以 四氢呋喃 、 甲苯 为溶剂， 反应 4.41h， 生成 4-methoxy-N-tert-octylaniline
  参考文献：
  名称：

  使用伯胺和仲胺进行钛介导的格氏试剂的胺化

  摘要：

  制作，然后破坏它：使用标题转化法，在苯胺衍生物的合成中使用N-氯代琥珀酰亚胺（NCS）作为氧化剂（参见方案）。胺和格氏试剂均具有良好的功能性。雄激素受体激动剂和几种类似物被合成以证明该方法的实用性。

  DOI：

  10.1002/anie.201103700

文献信息

• A Polystyrene-Cross-Linking Bisphosphine: Controlled Metal Monochelation and Ligand-Enabled First-Row Transition Metal Catalysis
  作者：Tomohiro Iwai、Tomoya Harada、Hajime Shimada、Kiichi Asano、Masaya Sawamura

  DOI：10.1021/acscatal.6b02988

  日期：2017.3.3

  bisphosphine monochelation to transition metals under conditions where homogeneous ligands may form bischelated single metal complexes or multinuclear complexes. PS-DPPBz showed high ligand performance in first-row transition metal catalysis, enabling challenging molecular transformations that were not possible through the screening of existing homogeneous ligands. In the Ni-catalyzed amination of aryl

  通过将4-叔丁基苯乙烯作为单体与四乙烯基化的1,2-双（二苯基膦基）苯（DPPBz）作为4倍交联剂之间的自由基乳液共聚反应，合成了聚苯乙烯交联双膦PS-DPPBz 。DPPBz双膦部分在交联网络有机聚合物的分支点处的位置允许受控的双膦单螯合在均相配体可形成双螯合的单金属络合物或多核络合物的条件下过渡金属。PS-DPPBz在第一行过渡金属催化中显示出高配体性能，可实现挑战性的分子转化，而这是通过筛选现有均相配体无法实现的。在镍-催化的芳基氯的胺化Ñ-烷基取代的伯胺，底物范围已扩大到包括2，6-二取代的芳基氯和N-叔烷基取代的伯胺。PS-DPPBz可有效用于Ni催化的1,3-唑与单环芳基新戊酸酯之间的C–H / C–O偶联，在已报道的基于1,2-双（二环己基膦基）乙烷的均相催化体系中，其反应性较差（DCYPE）。在铜或钴催化的烯烃加氢硼化反应中也证明了聚合物交联策略的有用性。
• Buttressing Effect as a Key Design Principle towards Highly Efficient Palladium/N-Heterocyclic Carbene Buchwald-Hartwig Amination Catalysts
  作者：Yin Zhang、Guy Lavigne、Noël Lugan、Vincent César

  DOI：10.1002/chem.201702859

  日期：2017.10.4

  The backbone substitution of the standard 1,3‐bis(2,6‐diisopropylphenyl)‐2H‐imidazol‐2‐ylidene (IPr) ligand by dimethylamino groups was previously shown to induce a dramatic improvement in the catalytic efficiency of the corresponding Pd–PEPPSI (pyridine‐enhanced pre‐catalyst preparation, stabilization, and initiation) pre‐catalysts in N‐arylation reactions. Herein, a thorough structure/activity study

  先前显示标准的1,3-双（2,6-二异丙基苯基）-2 H-咪唑-2-亚基（IPr）配体被二甲氨基取代的主链可显着提高相应Pd的催化效率N-芳基化反应中的–PEPPSI（吡啶增强的前催化剂的制备，稳定和引发）。在此，已经描述了用于合理化该有益效果的详尽的结构/活性研究。除了先前报道的IPr和IPr配体之外，新的IPr和IPr研究中设计并分析了分别带有一个较大的二异丙基氨基和二甲基氨基和氯取代基的组合的配体。发现主链取代的影响起源是空间性的，并且与芳烃化学中遇到的众所周知的支撑效应有关。通过开发一种高效的催化体系，用于庞大的α，α，α-三取代伯胺的芳基化反应，证明了这种方法的实用性和多功能性。根据[的PdCl（η优化系统3 -cinnamyl）（IPR ）]或[的PdCl（η 3 -cinnamyl）（IPR ）]预催化剂可在前所未有的温和条件下（催化剂负载量：0.5–2 mol％，反应温度：
• Compositions for the filling of high aspect ratio vertical interconnect access (VIA) holes
  申请人：Heraeus Precious Metals North America Conshohocken LLC

  公开号：US11289238B2

  公开（公告）日：2022-03-29

  A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

  无溶剂导电组合物可用于在基材表面制作导电线或在基材通孔内制作导电塞。无溶剂导电组合物一般由约 40 至约 95 wt % 的导电成分、约 4 至约 30 wt % 含有活性官能团的聚合物或低聚物、最多约 20 wt % 含有活性官能团的单体稀释剂和最多约 3 wt % 的固化剂组成。在某些情况下，无溶剂导电组合物还包括最多约 3 wt % 的润滑化合物。使用无溶剂导电组合物制成的基板可用于印刷电路板、集成电路、太阳能电池、电容器、电阻器、热敏电阻器、压敏电阻器、谐振器、传感器、电感器和多层铁氧体磁珠。
• COMPOSITIONS FOR THE FILLING OF HIGH ASPECT RATIO VERTICAL INTERCONNECT ACCESS (VIA) HOLES
  申请人：Heraeus Precious Metals North America Conshohocken LLC.

  公开号：US20210174983A1

  公开（公告）日：2021-06-10

  A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.
• [EN] COMPOSITIONS FOR THE FILLING OF HIGH ASPECT RATIO VERTICAL INTERCONNECT ACCESS (VIA) HOLES<br/>[FR] COMPOSITIONS POUR LE REMPLISSAGE DE TROUS D'ACCÈS D'INTERCONNEXION VERTICALE (VIA) À RAPPORT D'ASPECT ÉLEVÉ
  申请人：HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC

  公开号：WO2021112933A1

  公开（公告）日：2021-06-10

  A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent- free electroconductive composition is generally made of about 40 to about 95 wt% of a conductive component, about 4 to about 30 wt% of a polymer or oligomer comprising a reactive functional group, up to about 20 wt% of a monomeric diluent comprising a reactive functional group, and up to about 3 wt% of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt% of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.