申请人:Aoai Natsumi
公开号:US20100209669A1
公开(公告)日:2010-08-19
There is provided a photosensitive resin composition comprising:
(a) 100 parts by weight of a polyorganosiloxane obtained by a method of combining at least one silanol compound represented by the following formula (1):
R
1
2
Si(OH)
2
(1)
the groups in the formula being defined in the claims}, at least one alkoxysilane compound represented by the following formula (2):
R
2
a
R
3
b
Si(OR
4
)
4-a-b
(2)
the groups in the formula being defined in the claims} and a catalyst, and polymerizing them without active addition of water;
(b) 1-50 parts by weight of a photopolymerization initiator;
(c) 40-600 parts by weight of a fluorene compound represented by the following formula (3):
the groups in the formula being defined in the claims}; and
(d) 20-300 parts by weight of a compound other than component (c), having one or two (meth)acryloyl groups in the molecule.