2,2'-[氧双[(甲基-2,1-二乙基)氧]]二[2-甲基丙烷] | 69506-59-8

• 分子结构分类: 有机化合物 - 有机氧化合物
• 中文名称: 2,2'-[氧双[(甲基-2,1-二乙基)氧]]二[2-甲基丙烷]
• 中文别名: 一缩二丙二醇二异丁醚
• 英文名称: Dipropylene glycol di-tert-butyl ether
• 英文别名: 2-methyl-2-[2-[2-[(2-methylpropan-2-yl)oxy]propoxy]propoxy]propane
• CAS: 69506-59-8
• 化学式: C₁₄H₃₀O₃
• 分子量: 246.39
• InChiKey: YODIWCGDOXGYDK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  17
• 可旋转键数：
  8
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  27.7
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• POLYMER DISPERSIONS FOR CORROSION CONTROL
  申请人：ELIZALDE Oihana

  公开号：US20110245401A1

  公开（公告）日：2011-10-06

  The present invention relates to coating compositions which comprise dispersions of polymers obtained by a multistage procedure, to processes for preparing them, and to their use in corrosion protection.

  本发明涉及涂料组合物，其包括通过多阶段程序获得的聚合物分散体，涉及其制备过程以及它们在防腐保护中的使用。
• SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1598897A1

  公开（公告）日：2005-11-23

  A sealing agent for a photoelectric conversion device which comprises one or more of a compound having a glycidyl structure, a compound having a cyclohexene oxide structure, a compound having an oxetane structure and a compound having a vinyl ether structure, and a cationic polymerization initiator; a photoelectric conversion device using the sealing agent; and a solar cell comprising the photoelectric conversion device. The sealing agent for a photoelectric conversion device can be used for pasting together upper and lower electroconductive glass substrates at an ordinary temperature in the manufacture of a photoelectric conversion device, and is excellent with respect to adhesion strength and the reliability in moisture resistance.

  一种用于光电转换装置的密封剂，它包括具有缩水甘油结构的化合物、具有环己烯氧化结构的化合物、具有氧杂环丁烷结构的化合物和具有乙烯基醚结构的化合物中的一种或多种，以及阳离子聚合引发剂；一种使用该密封剂的光电转换装置；以及一种包含该光电转换装置的太阳能电池。用于光电转换装置的密封剂可用于在制造光电转换装置时在常温下将上下导电玻璃基板粘贴在一起，并具有出色的粘合强度和防潮可靠性。
• SEALANT FOR LIQUID CRYSTAL, LIQUID-CRYSTAL DISPLAY MADE WITH THE SAME, AND PROCESS FOR PRODUICNG THE DISPLAY
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1674919A1

  公开（公告）日：2006-06-28

  A liquid crystal sealant comprising an epoxy resin represented by the following formula (1): (in the formula, n denotes an average polymerization degree and is a positive number of 0-5) as a resin component, a curing agent, a curing accelerator and an inorganic filler is excellent in screen printability as a liquid crystal sealant in making a liquid crystal display device and can provide excellent reliability in moisture resistance for the liquid crystal display device obtained).

  一种液晶密封剂，由下式 (1) 所代表的环氧树脂组成： (式中，n 表示平均聚合度，为 0-5 的正数）作为树脂成分、固化剂、固化促进剂和无机填料，作为制作液晶显示装置的液晶密封剂，具有出色的丝网印刷性，并能为所获得的液晶显示装置提供出色的防潮可靠性）。
• LIQUID CRYSTAL SEALANT AND LIQUID CRYSTAL DISPLAY CELL UTILIZING THE SAME
  申请人：NIPPON KAYAKU KABUSHIKI KAISHA

  公开号：EP1780587A1

  公开（公告）日：2007-05-02

  [PROBLEMS] To provide a liquid crystal sealant that exhibits high bonding strength at high temperatures even at a cell gap as narrow as = 3 m, being able to provide a liquid crystal display cell of high reliability, and that with respect to the production process, is applicable to both of the conventional thermosetting sheet-fed process and jig press process. [MEANS FOR SOLVING PROBLEMS] There is provided a liquid crystal sealant comprising as essential components (a) epoxy resin, (b) curing agent containing at least one type of each of novolak resin and polyfunctional hydrazide compound, and (c) inorganic filler.

  [问题] 提供一种液晶密封剂，即使在电池间隙窄至＝3 米的情况下，它在高温下也能表现出 很高的粘接强度，能够提供可靠性很高的液晶显示电池，而且在生产工艺方面，它既 适用于传统的热固性片材供料工艺，也适用于夹具压制工艺。[解决问题的方法] 提供了一种液晶密封剂，其主要成分包括：(a) 环氧树脂；(b) 含有至少一种酚醛树脂和多官能酰肼化合物的固化剂；(c) 无机填料。
• ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION
  申请人：Toray Industries, Inc.

  公开号：EP3187559A1

  公开（公告）日：2017-07-05

  The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

  本发明提供了：一种具有优异耐热性的临时粘接剂，可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似器件的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。 本发明是一种临时粘接粘合剂，其特征在于它是一种聚酰亚胺共聚物，至少具有酸性二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基中的两种，通式(1)中的n是1至15的自然数，和(B1)由通式(1)表示的聚硅氧烷基二胺残基中的两种，通式(1)中的n是16至100的自然数，聚酰亚胺共聚物含有40-99.99摩尔％的(A1)残基和0.01-60摩尔％的(B1)残基。