Treatment of alkylidene-bridged zirconium-aluminum species with HMPA renders the CAl bond of the alkylidene unit susceptible to electrophilic attack; in the absence of HMPA, the CZr bond is attacked.
用HMPA处理亚烷基桥接的
锆铝物种使亚烷基单元的CAl键易受亲电子攻击;在没有HMPA的情况下,CZr键受到攻击。