申请人:Hitachi Chemical Company, Ltd.
公开号:EP1918341A1
公开(公告)日:2008-05-07
The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250°C, following heat treatment at a temperature of 150 to 230°C for a period of 0.3 to 5 hours, is not less than 0.2 MPa:
(wherein, the m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of -CH2-, -CHR- and -CR2- (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m ≥ 0.85, and R2 represents a tetracarboxylic acid residue).
本发明涉及一种由聚酰亚胺树脂(A)和热固性树脂(B)组成的胶膜,其中聚酰亚胺树脂(A)由具有下图所示式(I)代表的重复单元的聚酰亚胺树脂组成,在 150 至 230°C 的温度下进行 0.3 至 5 小时的热处理后,胶膜在 250°C 下的存储弹性模量不小于 0.2 兆帕:
(其中,m个R1基团各自独立地代表一个二价有机基团,m个R1基团包括总共k个有机基团,这些有机基团选自由-CH2-、-CHR-和-CR2-组成的组(其中,R代表1至5个碳原子的非环烷基),m代表不小于8的整数,m和k满足一种关系:k/m≥0.85,R2代表四羧酸残基)。