Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.
本文提出了具有最佳机械性能的介电材料,可用于激光烧蚀制图。这些材料包括选自聚
脲、聚
氨酯和聚酰
肼的聚合物。还提供了制备合适的聚酰
肼的新方法。这些方法的条件温和,制备出的可溶性聚合物在室温下稳定,可与可涂覆到微电子基板上的配方结合。这种介电材料具有高伸长率、低 CTE、低固化温度,并且在烧蚀后几乎不会留下任何碎屑。