Resin composition, reflector, lead frame with reflector, and semiconductor light-emitting device
申请人:DAI NIPPON PRINTING CO., LTD.
公开号:US10454008B2
公开(公告)日:2019-10-22
A resin composition including an olefin resin, an alkenyl-containing alkoxy silane compound, and at least one inorganic filler selected from the group consisting of titanium oxide, alumina, talc, clay, aluminum, aluminum hydroxide, mica, iron oxide, graphite, carbon black, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, and potassium titanate; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device. Accordingly, provided by the present invention are: a resin composition capable of expressing an excellent heat resistance (especially heat distortion resistance) even when it is made to a formed body; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device.
一种树脂组合物,包括一种烯烃树脂、一种含烯基的烷氧基硅烷化合物和至少一种选自氧化钛、氧化铝、滑石粉、粘土、铝、氢氧化铝、云母、氧化铁、石墨、炭黑、碳酸钙、硫化锌、氧化锌、硫酸钡和钛酸钾组成的组的无机填料;一种使用该树脂组合物的反射器;一种反射器承载铅框;以及一种半导体发光器件。因此,本发明提供了:一种即使制成成型体也能表现出优异耐热性(尤其是耐热变形性)的树脂组合物;一种使用该树脂组合物的反射器;一种反射器承载铅框;以及一种半导体发光器件。